Papers by Author: Panos Patsalas

Abstract: In this research, the possibility of applying multilayer multielement super hard coatings by Cathodic Arc is investigated. More precisely the structure of the coating consisting of quaternary CrAlSiN and ternary AlSiN layers is examined by electron microscopy, X-ray diffraction and X-ray photoelectron microscopy analytical methods. The as-deposited samples were found to have distinguishable layers. The CrAlSiN layer is characterized by an extra sequence of repeated nanolayers. The AlSiN layer consisted of nanosized grains having a preferential orientation. Finally the surface layer was found to contain a solid solution of CrxAl1-xN, while Si3N4was identified only by XPS most probably due to its amorphous structure.

Abstract: Zinc hot-dip galvanizing is one of the most effective methods for the corrosion protection of ferrous substrates. However, the failure of zinc coatings is possible when exposed to harsh environments for rather long periods. The application of a thin diamond like carbon (DLC) film on the top of the zinc coating might be a promising method for promoting their corrosion resistance. In the present work, a DLC thin film was deposited on zinc galvanized coatings by Plasma Enhanced Chemical Vapor Deposition. The as-formed film was composed of nanostructured and amorphous areas. The electron diffraction patterns acquired from the nanograins correspond to carbon phases with d-spacing ranging from diamond to graphite. Additionally, after 18 days of exposure in a simulated marine atmosphere, the DLC coated samples were proven to be more resistant than the naked galvanized coatings indicating its potential to improve the corrosion resistance of galvanized ferrous materials.

Abstract: The effect of chemical composition on the bonding environment of Cu, in a series of Ti1-x Cux and TiN/Cu films, is studied using X-Ray Absorption Spectroscopies (XAFS) at the Cu-K-edge. The EXAFS analysis reveals that in all studied samples Cu is amorphous. However, its bonding environment depends on the chemical composition. More specifically, in the Ti1-xCux films, Cu is coordinated with Ti and Cu and belongs both to intermetallic TiCu and to an amorphous Cu matrix. The coordination number of Cu, i.e., the sum of Ti and Cu first neighbours, increases systematically from 6.3 ± 0.7 to 10.6 ± 0.9 when the Cu content increases from 24.1 to 52.7 at%. On the contrary, in the TiN/Cu films, the type of atoms that consists the 1st nearest neighbour shell of Cu varies as a function of the Cu concentration. More specifically, in the TiN/Cu film with the lowest Cu content (27.3 at%), intermetallic TiCu is detected. At intermediate Cu concentration (37.8 at%), Cu is bonded to both Ti and Cu atoms. Finally, in the TiN/Cu film with the highest Cu content (67.7 at%), Cu is metallic.