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Articles by author: Paul W. Mertens

• A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings
  Published in: Ultra Clean Processing of Silicon Surfaces V (p223)
• A Force Study in Brush Scrubbing
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p279)
• A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p165)
• A Study of the Influence of Typical Wet Chemical Treatments on the Germanium Wafer Surface
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p27)
• Aging Phenomena in the Removal of Nano-Particles from Si Wafers
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p155)
• All Wet Photoresist Strip by Solvent Aerosol Spray
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p285)
• Analyzing the Collapse Force of Narrow Lines Measured by Lateral Force AFM Using an Analytical Mechanical Model
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p55)
• Application of Single-Wafer Wet Cleaning Prior to Epitaxial SiGe Process
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p173)
• Behaviour of Metallic Contaminants during Mos Processing
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p11)
• Challenges of Single-Wafer Wet Cleaning for Low Temperature Pre-Epitaxial Treatment of SiGe
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p243)
• Chemistry of the Silicon Oxide Surface: Adsorption from SC1 Solutions
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p53)
• Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p281)
• Differential Interference Contrast Microscopy of Defects in As-Grown and Annealed Si Wafers
  Published in: Gettering and Defect Engineering in Semiconductor Technology VII (p387)
• Drying of High Aspect Ratio Structures: A Comparison of Drying Techniques via Electrical Stiction Analysis
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p87)
• Effect of Chemical Solution on the Stability of Low-k Films
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p349)