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Articles by author: Paul W. Mertens

• Single-Wafer Wet Chemical Oxide Formation for Pre-ALD High-k Deposition on 300 mm Wafer
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p53)
• Stripping of Ion Implanted Photoresist by CO₂ Cryogenic Pre-Treatment Followed by Wet Cleaning
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p289)
• Stroboscopic Schlieren Study of Bubble Formation during Megasonic Agitation
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p185)
• Study of the Dynamics of Local Particle Removal Efficiencies Using Localized Haze Maps
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p233)
• Study of the Etching Mechanism of Heavily Doped Si in HF
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p41)
• Surface Characterization after Different Wet Chemical Cleans
  Published in: Ultra Clean Processing of Silicon Surfaces V (p67)
• Surface Passivation for Si Solar Cells: A Combination of Advanced Surface Cleaning and Thermal Atomic Layer Deposition of Al₂O₃
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p357)
• The Effect of Ion Implantation on the Metal Contamination of Silicon Surfaces in Aqueous Solution
  Published in: Ultra Clean Processing of Silicon Surfaces V (p7)
• The Impact of Backside Particles on the Limits of Optical Lithography
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p129)
• The Importance of Cavitation Hysteresis in Megasonic Cleaning
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p171)
• The Influence of Standing Waves on Cleaning with a Megasonic Nozzle
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p23)
• The Influence of the Angle of Incidence in Megasonic Cleaning
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p163)
• The Removal of Silica Particles from Micron Wide Trenches by Megasonic Cleaning
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p221)
• The Rinsing Problem: Effect of Solute-Surface Interactions on Wafer Purity
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p1)
• Uniformity of Particle Removal by Aerosol Spray
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p149)