HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by author: Ping Zhao

• Approach of Realizing Material Removal at Nanometer Level in Ultraprecision Polishing
  Published in: Advances in Grinding and Abrasive Processes (p466)
• Investigation of Semi-Fixed Abrasive Plate Wear Characteristics
  Published in: Advances in Abrasive Technology XIII (p1029)
• Modeling and Simulation of Lapping Processes Based on Grain Size Sensitivity Model
  Published in: Advances in Grinding and Abrasive Technology XIII (p389)
• Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains
  Published in: Ultra-Precision Machining Technologies (p253)
• On the Characteristic Parameters of the Semi-Fixed Abrasive Plate
  Published in: Ultra-Precision Machining Technologies (p291)
• Particle Flow Simulation on Semi-Fixed Abrasive Tool Processing
  Published in: Advances in Grinding and Abrasive Technology XVI (p175)
• Process Parameters Influence on Semi-Fixed Abrasive Tool Wear
  Published in: Advances in Abrasive Technology XIV (p251)
• Research on Ultra-Precision Lapping Technology for Super-Smooth Surface of KTP Crystal
  Published in: Advances in Machining & Manufacturing Technology VIII (p284)
• Simulation Study on the Developed Eccentric V-Grooves Lapping Mode for Precise Ball
  Published in: Advances in Grinding and Abrasive Technology XIII (p300)
• Study on Sphere Shaping Mechanism of Ceramic Ball for Lapping Process
  Published in: Advances in Grinding and Abrasive Processes (p195)
• Study on the Mechanism of the Continuous Composite Electroplating Polishing for Silicon Wafer
  Published in: Advances in Machining & Manufacturing Technology VIII (p289)
• Study on Ultra-Precise Machining of CLBO Crystal
  Published in: Advances in Grinding and Abrasive Technology XIII (p398)
• Study on Wear Mode of Silicon Nitride Balls in Lapping Process
  Published in: Advances in Grinding and Abrasive Technology XIII (p403)
• Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy Films
  Published in: Surface Finishing Technology and Surface Engineering (p141)
• The Quantitative Evaluation on the Lapping Uniformity of Rotated Dual-Plates Lapping Mode
  Published in: Advances in Engineering Design and Optimization (p1534)