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Articles by author: Ren Ke Kang

• A Method for Grinding Mode Identification in Grinding of Silicon Wafers
  Published in: Precision Surface Finishing and Deburring Technology (p255)
• A Method to Improve Uniformity of Material Removal of Chemical Mechanical Polishing in LCOS Process
  Published in: Optics Design and Precision Manufacturing Technologies (p686)
• A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers
  Published in: Advances in Abrasive Technology XIII (p707)
• A Novel Single Step Thinning Process for Extremely Thin Si Wafers
  Published in: Advances in Abrasive Technology XII (p434)
• A Physical Machining Accuracy Predicting Model in Turning
  Published in: Advances in Abrasive Technology IX (p675)
• A Practical Method for Improving the Pointing Accuracy of the Antenna-Radome System
  Published in: Advances in Abrasive Technology VI (p183)
• A Study of the Molecular Dynamics Simulation in Nanometric Grinding
  Published in: Advances in Abrasive Technology VI (p33)
• A Suspending Abrasives and Porous Pad Model for the Analysis of Lubrication in Chemical Mechanical Polishing
  Published in: Advances in Machining & Manufacturing Technology VIII (p775)
• An Experimental Study of the Polishing Process for MgO Single Crystal Substrate
  Published in: Advances in Abrasive Technology IX (p225)
• Analysis and Compensation Following Error of Feed Drive in CNC
  Published in: Advanced Mechanical Engineering (p591)
• Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior
  Published in: Physical and Numerical Simulation of Material Processing VI (p313)
• Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement Trajectories
  Published in: Surface Finishing Technology and Surface Engineering (p119)
• Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers
  Published in: Advances in Abrasive Technology XI (p36)
• Corrosion Inhibiting Effect on Copper Chemical Mechanical Planarization (CMP) in Fe(NO₃)₃ Based Slurries
  Published in: Advances in Abrasive Technology VIII (p395)
• Deformation and Acoustic Emission during Nanoindentation on Single Crystal MgO (001) Plane
  Published in: Advances in Abrasive Technology XII (p404)