Papers by Author: Rong Yan Chuai

Abstract: 3-layer anodic bonding is one of the key technologies in the manufacture of complicated structure. The microcosmic process and current model of the 3-layer anodic bonding was investigated, and a new technology scheme with better bonding effect was developed. Using the experiment device, quantities of bonding current curves were obtained by the data collecting system. Under tensile testing device, intensity of the bonding was tested. By analysis of the data collected, the 3-layer bonding model was inspected, and the efficacy of the new technology scheme was proved.

Abstract: To simulate the whole process of anodic bonding accurately, this paper makes the research on the current of anodic bonding with area and point cathode respectively. Based on the known models of anodic bonding, novel current formulas are deduced for anodic bonding with area cathode by means of the relation between glass resistivity and temperature. After calibrated by statistics of experimental data, the formulas quantitatively describe the relation between bonding current with time, as well as bonding voltage and bonding temperature. Further, using spreading model of anodic bonding, an approach to dealing with the problem of point cathode current is presented. The experiments prove that the current formulas from the approach are able to indicate the law of point cathode current.

Abstract: The paper presents a micro-fluidics cooling system which is designed on a silicon substrate including a micro-pump, two temperature sensors, a flow sensor and some microchannels. To design the cooling system optimally, a finite element model is built. The temperature distribution on the silicon substrate is analyzed using the model. Moreover, the quantitative relation is given of the temperature distribution, flow velocity and driving capability of the micro pump. Consequently, the structure parameters and design requirements of the cooling system are obtained.