Papers by Author: Rui Zhang

Paper TitlePage

Abstract: In this paper, a novel conductive silver adhesive (ECA) for transducer is prepared to bond piezoelectric patch and the aluminum substrate. X-ray photoelectron spectroscopy (XPS) is used to study the fracture elements in order to analyze bond mechanics, fracture morphology is observation by scanning electron microscopy (SEM). The result of test and analysis shows ECA with sliane coupling agent have both physical and chemical bonding and the fracture type is cohesive failure. However the ECA without sliane coupling agent only has physical bonding and fracture type is mixed failure.
837
Abstract: Ge2Sb2Te5 thin films and Si doped Ge2Sb2Te5 thin films were deposited by electron beam evaporation method. The crystallization behaviors of the films were investigated by using the in situ resistance measurement. Through in situ resistance measurement, the increases of amorphous stability, crystallization rate and crystalline resistivity after Si doping were observed. The promoted nucleation process and the retardation of crystal growth were found in Si doped samples through the calculation of JMAK equation.
1044
Abstract: A three-dimensional mathematical model is developed for a kind of micro heat pipe with fiber wick. The effects of phase changing, the contact angle, gravity, and heat conducting between the fibers are accounted in the model. The governing equations are formulated in the control volume and calculated by iteration. The calculated results of the model present the velocity of the working material and the phase changing rate of the liquid. The structure of the micro heat pipe is optimized by the calculated results of the model and the two levels of fibers are enough for this kind of flat micro heat pipe.
261
Showing 1 to 3 of 3 Paper Titles