Papers by Author: Salvatore Di Franco

Abstract: In this work, the electrical properties of Mo₂C/4H-SiC Schottky contacts were studied at different annealing temperatures. In particular, the Schottky barrier height was derived by current-voltage measurements on as-deposited and 400 °C and 700 °C-annealed contacts. The Schottky barrier height was comparable for the as-deposited and 400°C-annealed Mo₂C/4H-SiC contact (0.94 and 0.96 eV, respectively), while it increased (1.07 eV) for the 700 °C-annealed Mo₂C/4H-SiC one. For the sample annealed at 700°C, the electrical characterization of the diodes was combined with the study of the surface and interface electrical properties, by Kelvin-probe force microscopy (KPFM) and frequency dependent capacitance-voltage measurements (C-f-V) and discussed assuming a Mo/4H-SiC Schottky contact (F_B =1.39 eV) as a reference. The KPFM measurements revealed a similar value of the surface potential, thus suggesting that the work function of the metal is the same in both cases. On the other hand, a higher density of interface state was obtained by C-f-V for the Mo₂C/4H-SiC system. This latter can explain the reduction of the Schottky barrier height observed for this system.

Abstract: This paper reports on the effect of a sulfurization thermal process of the silicon carbide surface on the properties of Ni/4H-SiC Schottky barrier. In particular, the incorporation of sulfur (S) in the 4H-SiC near-surface region was observed at the process performed at 800 °C, without any significant effect on the surface morphology. On the other hand, Ni/4H-SiC Schottky contacts fabricated on the sulfurized 4H-SiC surface showed a 0.3 eV reduction of the average barrier height with a narrower distribution, with respect to the untreated sample. These results were explained by an increase of the 4H-SiC electron affinity after sulfurization, and a Fermi level pinning effect.

Abstract: In this work, we investigated the electrical properties evolution of Mo/4H-SiC Schottky contacts following thermal annealing treatments at temperature up to 950 °C. The electrical characterization under forward and reverse bias revealed a reduction of the barrier height from 1.45 eV (as-deposited contact) to 1.30 eV (950°C-annealed contact), with the presence of inhomogeneity in the contact, while the leakage current followed a thermionic-field emission (TFE) model after annealing at 750 °C and presented a significant increase for the 950°C-annealed contact. The electrical characterization was associated with microstructural analyses, which highlighted an enlargement of the grains forming the structure of the Mo-film and the presence of voids near the Mo/4H-SiC interface. These observations can be at the base of the variation in the electrical behavior of the contact.

Abstract: In this paper, we explore the effects of excimer laser irradiation on heavily Aluminum (Al)-implanted silicon carbide (4H-SiC) layer. 4H-SiC layers were exposed to UV-laser radiation (308 nm, 160 ns), at different laser fluences and the effects of the laser exposure surface were evaluated from morphological, micro-structural and nano-electrical standpoints. Depending on the irradiation condition, significant near-surface changes were observed. Moreover, the electrical characteristics of the implanted layer, evaluated by means of transmission line method, gave a sheet-resistance of 1.62×10⁴ kW/sq for the irradiated layer, linked to a poor activation of the p-type dopant and/or a low mobility of the carriers in the laser-modified 4H-SiC layer. This study can be useful for a fundamental understanding of laser annealing treatments of 4H-SiC implanted layers.

Abstract: In this work, we focus on the electrical characterization of Ni Schottky contact on n-type heavily doped (N_D>10¹⁹ cm⁻³) 4H-SiC layer, achieved by P-ion implantation. In particular, the forward current–voltage characterization of Schottky diodes showed a reduced turn-on voltage for the Ni/heavily-doped 4H-SiC if compared to a reference Ni/4H-SiC Schottky contact fabricated under similar conditions but without implant. Moreover, it was observed the predominance of a thermionic-field-emission (TFE) mechanism for the current transport through the interface. From a current-voltage-temperature (I-V-T) study, the temperature-dependence of the Schottky barrier and doping concentration were evaluated, obtaining a reduction of the barrier (from 1.77 to 1.66 eV), while the doping concentration maintains constant around 1.96×10¹⁹ cm^-3. This study provides useful insights for a deeper comprehension of the electrical behavior of Ni contacts and can have possible applications in 4H-SiC Schottky diode technology.

Abstract: This paper presents a macro-and nanoscale electrical investigation of Schottky and metal-oxide junctions with hetero-epitaxial 3C-SiC layers grown on Si. Statistical current-density-voltage (J-V) characterization of Pt/3C-SiC Schottky diodes showed an increase of the reverse leakage current with increasing the devices diameters. Furthermore, C-V and J-V analyses of SiO₂/3C-SiC capacitors revealed non-idealities of the thermal oxide, such as a high trapped positive charge (3×10¹² cm⁻²) and a reduced breakdown field (E_BD=6.5 MV/cm) compared to ideal SiO₂. Nanoscale electrical characterizations by conductive atomic force microscopy (CAFM) and scanning capacitance microscopy (SCM) allowed to shed light on the origin of non-ideal behavior of Schottky and thermal oxide junctions, by correlating the morphological features associated to 3C-SiC crystalline defects with local current transport and carrier density.

Abstract: Gallium nitride (GaN) and its AlGaN/GaN heterostructures grown on large area Si substrates are promising systems to fabricate power devices inside the existing Si CMOS lines. For this purpose, however, Au-free metallizations are required to avoid cross contaminations. In this paper, the mechanisms of current transport in Au-free metallization on AlGaN/GaN heterostructures are studied, with a focus on non-recessed Ti/Al/Ti Ohmic contacts. In particular, an Ohmic behavior of Ti/Al/Ti stacks was observed after an annealing at moderate temperature (600°C). The values of the specific contact resistance ρ_c decreased from 1.6×10⁴ Ω^.cm² to 7×10⁵ Ω^.cm² with increasing the annealing time from 60 to 180s. The temperature dependence of ρ_c indicated that the current flow is ruled by a thermionic field emission (TFE) mechanism, with barrier height values of 0.58 eV and 0.52 eV, respectively. Finally, preliminary results on the forward and reverse bias characterization of Au-free tungsten carbide (WC) Schottky contacts are presented. This contact exhibited a barrier height value of 0.82 eV.

Abstract: In this paper, the electrical properties of a thermal oxide (SiO₂) grown onto 3C-SiC layers on silicon were investigated, by monitoring the behavior of MOS capacitors. In particular, the growth rate of thermal SiO₂ was dependent on the different surface roughness condition. However, independent of the roughness a high density of positive charge was detected. The sample having the smooth surface (subjected to CMP) showed a notably improved dielectric breakdown (BD) field. However, the best BD on macroscopic MOS capacitors was still far from the ideal behavior. Additional insights could be gained employing a nanoscale characterization that revealed the detrimental role of persisting extended defects in the semiconductor. In the semiconductor region far from extended defects the nanoscale BD kinetics was nearly ideal.

Abstract: This paper reports on the formation and characterization of Ohmic contacts to n-type and p-type type 3C-SiC layers grown on silicon substrates. In particular, Ohmic contact behavior was obtained either using Ni or Ti/Al/Ni layers annealed at 950°C. The values of the specific contact resistance ρ_c estimated by means of circular TLM (C-TLM) structures varied in the range ~ 10^-3-10^-5 Ωcm², depending on the doping level of the 3C-SiC layer. A structural analysis performed by X-Ray Diffraction (XRD) allowed to identify the main phases formed upon annealing, i.e., Ni₂Si and Al₃Ni₂. The morphology of the reacted contacts depended on that of the underlying substrate. The results can be useful for the development of a variety of devices on the cubic 3C-SiC polytype.

Abstract: This work reports on the electrical and microstructural properties of Ti/Al/Ni contacts to p-type implanted 4H-SiC obtained by rapid thermal annealing of a metal stack of Ti (70 nm)/Al (200 nm)/Ni (50 nm). The contact characteristics were monitored at increasing value of the annealing temperature. The Ohmic behavior of the contact, with a specific contact resistance value of 2.3×10^-4 Ω·cm², is obtained for an annealing at 950 °C. The structural analyses of the contact, carried out by XRD and TEM, reveal the occurrence of reactions, with the detection of the Al₃Ni₂ and AlTi phases in the upper part of the contact and of an epitaxially oriented TiC layer at the interface. These reactions are considered the key factors in the formation of an Ohmic contact in our annealed Ti/Al/Ni system. The temperature-dependence study of the electrical characteristics reveals a predominant thermionic field emission (TFE) mechanism for the current conduction through the contact, with a barrier height of 0.56 eV.