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Articles by author: Seung Boo Jung

• A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p405)
• Analysis of the Test Parameters in the Shear Test of BGA Solder Joints
  Published in: Advances in Fracture and Strength (p851)
• Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing
  Published in: THERMEC 2006 Supplement (p633)
• Characteristics of ZnO Thin Film by Atomic Layer Deposition for Film Bulk Acoustic Resonator
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p977)
• Diffusion of Copper, Iron and Silicon in Ni₃Al
  Published in: Diffusion in Materials - DIMAT 1992 (p859)
• Diffusion of Platinum and Molybdenum in Ni and Ni₃Al
  Published in: Diffusion in Materials DIMAT 1996 (p257)
• Effect of PWHT on Behaviors of Precipitates and Hardness Distribution of 6061 Al Alloy Joints by Friction Stir Welding Method
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p601)
• Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength
  Published in: Eco-Materials Processing & Design VII (p546)
• Friction Stir Welding of Dissimilar Formed Mg Alloys (AZ31/AZ91)
  Published in: Eco-Materials Processing & Design VI (p249)
• Grain Growth Behavior and Mechanical Properties of the Friction Stir Welded Zone of 7055 Al Alloy Followed by Post Weld Heat Treatment
  Published in: THERMEC 2006 (p4087)
• Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p893)
• Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging
  Published in: Eco-Materials Processing & Design VI (p273)
• Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p897)
• Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni under Bump Metallization during Multiple Reflows
  Published in: THERMEC 2006 Supplement (p181)
• Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps
  Published in: Eco-Materials Processing & Design VII (p550)