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Articles by author: Stefan De Gendt

• A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings
  Published in: Ultra Clean Processing of Silicon Surfaces V (p223)
• A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p165)
• A Study of the Influence of Typical Wet Chemical Treatments on the Germanium Wafer Surface
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p27)
• Behaviors of Metallic Contaminants in Si Wafer Processing
  Published in: Ultra Clean Processing of Silicon Surfaces V (p123)
• Behaviour of Metallic Contaminants during Mos Processing
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p11)
• Can we Increase the Effiency of Organic Contamination Removal by Ozone/DI-Water Processes by Using Additives?
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p215)
• Determination of Photoresist Degradation Products in O₃/DI Processing
  Published in: Ultra Clean Processing of Silicon Surfaces V (p207)
• Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p101)
• From Piranha to Barracuda: Mechanism of Ozone and Water Vapor Photoresist Strip in a Wet Bench
  Published in: Ultra Clean Processing of Silicon Surfaces V (p227)
• Galvanic Corrosion of Stacked Metal Gate Electrodes during Cleaning in HF Solutions
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p87)
• HF Based Solutions for HfO₂ Removal; Effect of pH and Temperature on HfO₂: SiO₂ Etch Selectivity
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p97)
• Hydrogen Peroxide Decomposition in Ammonia Solutions
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p15)
• Introduction of High-k Materials into Wet Processing, Analysis and Behavior
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p19)
• Investigation of Metallic Contamination Analysis Using Vapor Phase Decomposition – Droplet Collection – Total Reflection X-Ray Fluorescence (VPD-DC-TXRF) for Pt-Group Elements on Silicon Wafers
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p273)
• Materials Compatibility and Organic Build-Up during Ozone-Based Cleaning of Semiconductor Devices
  Published in: Ultra Clean Processing of Silicon Surfaces V (p63)