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Articles by author: Sung Hoon Choa

• Direct CTE Measurement Technique for the MEMS Materials
  Published in: Experimental Mechanics in Nano and Biotechnology (p199)
• Effects of Packaging Induced Stress on MEMS Devices and Its Improvements
  Published in: Experimental Mechanics in Nano and Biotechnology (p529)
• Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
  Published in: Advances in Fracture and Strength (p588)
• Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
  Published in: Fracture and Damage Mechanics V (p231)
• Force-Calibrated AFM for Mechanical Test of Freestanding Thin Films
  Published in: Advances in Fracture and Strength (p275)
• Mechanical Properties of Al-3%Ti Thin Film for Reliability Analysis of RF MEMS Switch
  Published in: Fracture and Strength of Solids VI (p1319)
• New Structures and Techniques for Easy Axial Loading Test of Static and Fatigue Properties of MEMS Materials
  Published in: Advances in Fracture and Strength (p545)
• Novel Test Procedure of Tensile Test for MEMS Materials
  Published in: Advanced Nondestructive Evaluation I (p136)
• Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding
  Published in: Experimental Mechanics in Nano and Biotechnology (p609)
• Size Effect on Tensile Strength of Surface-Micromachined Al-3%Ti Thin Films
  Published in: Experimental Mechanics in Nano and Biotechnology (p313)
• Thermal Transport Properties of Various Thin Films for MEMS Applications
  Published in: Experimental Mechanics in Nano and Biotechnology (p293)
• Thermo-Mechanical Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change
  Published in: Fracture and Damage Mechanics V (p227)