Papers by Author: T. Veltens

Abstract: Cleaning of nano-particles is becoming a major challenge in semiconductor manufacturing as efficient particle removal must be achieved without substrate loss and without damage to fragile structures. In this work cleaning performance and structural damage by a mixed fluid-jet technique were evaluated and directly compared to the performance of several megasonic systems. The test vehicles were hydrophilic Si wafers contaminated with 78-nm SiO2 particles and 70-nm poly-gatestack line patterned wafers. The results showed a broader process window for particle removal without damaging for the mixed fluid-jet technique compared to the megasonic systems.