Papers by Author: Takayuki Kitajima

Abstract: Carbon-fiber-reinforced plastic (CFRP) is used in various industries such as aerospace and automobile industries because of its high mechanical characteristics. However, this material is difficult to cut. Tool wear and delamination frequently occur during the drilling or cutting of CFRP. In previous studies, we developed a CFRP cutting tool using polycrystalline diamond (PCD). The PCD tool exhibited excellent cutting performance at cutting speeds as low as <120 m/min. In this study, the authors investigated the effect of cutting speed on the face milling of CFRP by using the developed PCD tool.

Abstract: For the backgrinding of semiconductor devices, a rotary grinding process is indispensable for achieving the required wafer thickness. The relative velocity between the grinding wheel and the wafer is maximum at the periphery of the wafer and minimum at the center of wafer. Generally, the grinding performances are discussed in terms of the ratio of the rotational speeds of the grinding wheel and the wafer. However, it is not possible to use this ratio to determine the grinding conditions for different wafer sizes grinding as this ratio does not show the difference in relative velocity. Therefore, a new relative velocity ratio was defined in this study. Then, the Si wafer grinding was performed to investigate the effect of the surface roughness and the power consumption of the grinding wheel spindle on the relative velocity ratio.

Abstract: Increasing the wafer diameter from φ300 mm to φ450 mm is required to enhance semiconductor devices productivity. A high-stiffness rotary grinding machine equipped with water hydrostatic bearings was developed for a φ450 mm silicon wafer. The grinding machine has an upper structure consisting of a wheel spindle system and a lower structure consisting of a rotary worktable system. The spindle shaft creates both rotary and axial feeding motion. The upper and lower structures are clamped together rigidly by three kinematic couplings. A higher loop stiffness is required for the grinding machine because grinding the larger wafer requires a higher grinding force. This paper investigates the loop stiffness of the developed wafer grinding machine.

Abstract: The use of hard and brittle materials for manufacturing optical parts, such as dies and molds are required in order to extend mold life. Although, cobalt-free tungsten carbide is one of the hardest materials, micro-cutting is very difficult due to its hardness and its brittleness. This paper investigates face turning of cobalt-free tungsten carbide using a nanopolycrystalline diamond [NPD] tool and Zinc dialkyldithiophosphate (ZnDTP) fluid. Surface roughness of the cobalt-free tungsten carbide achieved was 22nmRz, which is far larger than the theoretical value. That is, traditional cutting theory does not directly apply for face turning of cobalt-free tungsten carbide using NPD tool and ZnDTP fluid.

Abstract: Interest in carbon-fiber-reinforced plastic (CFRP) has been growing for the last several years. CFRP, a composite material made of carbon fibers and resins, has high mechanical characteristics and is well known as a difficult-to-cut material. During the process of drilling or cutting of CFRP, tool wear and delamination occur frequently. In this study, the authors developed a milling tool for CFRP using polycrystalline diamond, and the cutting performance of the developed tool was investigated.

Abstract: Carbon Fiber Reinforced Plastic (CFRP) is a high-strength and high-elastic-modulus composite material that is hardened by impregning carbon fiber with epoxy resin. Although, many sutdies of hole drilling of CFRP have been conducted, few sutdies of face milling of CFRP have been carried out. Face milling is necessary for surfaceing of aerospace parts, which is indispensable for airplane construction. Machining of CFRP is difficult because of the extreme tool wear and delamination that occur. The authors investigated face milling of CFRP using a newly developed Poly Crystalline Diamond (PCD) tool. The resultts show, that the cutting force and surface roughness are affected by the fiber orientation of the CFRP, and that delamination can easily occur in the outer layer of face-nilled CFRP.

Abstract: Micro-machining of hard dies and molds for optical parts or precision instruments is required to extend die and mold life. This paper investigates the effect of cutting fluid on diamond tool life under micro V-groove turning of cobalt-free tungsten carbide. Zinc dialkyldithiophosphate fluid (ZnDTP) displayed excellent diamond tool wear resistance in previous experiments. The performance of this cutting fluid is compared to newly developed vegetable oil based cutting fluid with dispersed MoS₂ nanotubes. This paper investigates nanopolycrystalline diamond (NPD) tool life with a rake angle of 0° and-30° under continuous micro V-groove turning (i.e. face turning), of cobalt-free tungsten carbide using the developed cutting fluids. Superior diamond tool edge wear resistance is observed when using the dispersed MoS₂ nanotubes in vegetable oil and using a NPD tool with a-30° rake angle.

Abstract: There is a compelling need for development of a surface grinding machine for 450mm diameter silicon-wafers. The authors have developed a new surface grinding machine for the large scale silicon-wafers. The machine has a rotary work table equipped with a constant-flow hydrostatic water bearing. The table system has to attain high static stiffness to achieve higher loop stiffness. This paper investigates static performances of the rotary table by numerical computation. The obtained results are compared with the experimental ones. Accordingly, it is verified that the developed rotary table has sufficient static performances for the large scale silicon-wafer grinding machine.

Abstract: Micro V-groove cutting of cobalt-free tungsten carbide using two types of V-shaped diamond tools is performed using mist of zinc dialkyl-dithiophosphate (ZnDDP) as lubricant. The two types of tool tested are 1) mono-crystalline diamond and 2) poly-crystalline diamond made of approximately 30 nm-sized diamond crystals. The geometry of the V-groove-cutting process is theoretically investigated and the relationship between V-groove angle, original rake angle, and effective rake angle is clarified. Through the cutting experiments, the effects of diamond types and rake angle on tool-wear characteristics are explained. When rake angle is set at zero degrees, tool chipping frequently occurs for both types of diamond tools even when ZnDDP is supplied. However, when rake angle is set at -30 degrees for poly-crystalline diamond, tool wear is minimized.

Abstract: This paper proposes a new grinding-fluid-supply system for improving the grinding performance of a CBN wheel. The system generates cavitations in the fluid flow, which is expected to provide higher cooling and superior grinding-chip removal capability. The system is applied to one-pass surface grinding of steel plates, and residual stress and surface roughness are evaluated. The system has a major effect on improving surface roughness, but has a minor effect on reducing the residual stress under shallow-cut grinding conditions. The effects appear greater under the heavier grinding conditions.