Authors: Atsuki Hidaka, Akinobu Takeshita, Kohei Ogawa, Tatsuya Imamura, Kota Takano, Kazuya Okuda, Hideharu Matsuura, Shi Yang Ji, Kazuma Eto, Takeshi Mitani, Kazutoshi Kojima, Tomohisa Kato, Sadafumi Yoshida, Hajime Okumura
Abstract: We measure the temperature-dependent resistivity (ρ(T)) for thick heavily Al- and Ncodoped p-type 4H-SiC samples grown by chemical vapor deposition (CVD), physical vapor transport (PVT), and solution growth (SG), and investigate their conduction mechanisms. For samples with an Al concentration (CAl) of 3.5×1019 to 1×1020 cm-3 grown by CVD, PVT, and SG, the conduction mechanisms at high and low temperatures are band and nearest-neighbor hopping (NNH) conduction, respectively. In the range CAl of 1×1019 to 3.5×1019 cm-3, on the other hand, an anomalous conduction, referred to as X conduction here, is observed between the band and NNH conduction regions for the samples grown by CVD and PVT, but not those grown by SG. One of the differences between the samples grown by CVD and PVT and those grown by SG is the off-orientation toward [11-20] of the (0001) 4H-SiC substrate. We discuss the reason for the appearance of X conduction, which appears to be consistent with dopant-concentration inhomogeneity model.
224
Authors: Naohiro Sugiyama, Takeshi Mitani, Isaho Kamata, Tomohisa Kato, Hidekazu Tsuchida, Hajime Okumura
Abstract: The scratch damage that caused the generation of double Shockley stacking faults (DSFs) in heavily nitrogen doped 4H-SiC crystal was investigated quantitatively. Scratch tests were carried out on 4H-SiC substrates with a nitrogen concentration of 2.6 × 1019 cm-3. A residual tensile stress of 40 MPa was detected around the scratch loaded at 30 mN with a diamond tip. DSFs were generated from this scratch by annealing at 1100°C for 2 h in Ar atmosphere. After annealing, the residual stress around the scratch was reduced to a tensile stress of 10 MPa. This result suggests that the reduction of residual stress around the scratch coincided with the formation of DSFs.
427
Authors: Naoyoshi Komatsu, Takeshi Mitani, Yuichiro Hayashi, Hiromasa Suo, Tomohisa Kato, Hajime Okumura
Abstract: We have developed the bulk growth technique to reduce threading screw dislocations (TSDs) by combining solution growth and PVT growth methods. More than 80 % of TSDs in original seed crystals were successfully converted to Frank defects on basal planes by the solution growth on 4° off C-face with Si-5at.% Ti solvent. After PVT growth on the as-grown surface of the conversion layer, TSDs in the original seed were successfully reduced. The presence of micrometer-size macrosteps in the initial stage of PVT growth is important to continue to propagate the converted Frank defects on basal planes during PVT bulk growth.
71
Authors: Naoyoshi Komatsu, Takeshi Mitani, Yuichiro Hayashi, Tomohisa Kato, Hajime Okumura
Abstract: We have investigated the dependence of the macrostep height on various additives in solution growth of n-type 4H-SiC. Surface modification by adding transition elements in periods 4‒6 (Sc, Ti, V, Mn, Fe, Co, Ni, Cu, Y, Nb, Mo, Ce, and W) and group 13‒14 elements (B, Al, Ga, Ge, Sn) was systematically studied to find additives improving smoothness of the growth surface. We found that Sc, Co, Mo, and Ge improved surface smoothness in addition to the already-known additives, such as Al, B, and Sn. Besides, these additives (Sc, Co, Mo, Ge) give no measurable influence on the conductivity of n-type grown crystals. These results demonstrated that Sc, Co, Mo, Ge and Sn are useful additives for solution growth of n-type 4H-SiC.
55
Authors: Akira Nakajima, Yosuke Tateishi, Hiroshi Murakami, Hidetomo Takahashi, Michiharu Ota, Ryoji Kosugi, Takeshi Mitani, Shin Ichi Nishizawa, Hiromichi Ohashi
Abstract: A novel dicing technology that utilizes femtosecond pulsed lasers (FSPLs) are demonstrated as a high-speed and cost-effective dicing process for SiC wafers. The developed dicing process consists of cleavage groove formation on a SiC wafer surface by the FSPL, followed by chip separation by pressing a cleavage blade. The effective FSPL scan speed on the SiC surfaces was 33 mm/s. Kerf loss can be negligible in the developed FSPL dicing process. In addition, the residual lattice strain in the FSPL-diced SiC chips was comparably small to that of the conventional mechanical process using diamond saws, due to the absence of the lattice heating effect in femtosecond-laser processes.
524
Authors: Naoyoshi Komatsu, Takeshi Mitani, Tetsuo Takahashi, Tomohisa Kato, Kazuhisa Kurashige, Yuji Matsumoto, Toru Ujihara, Hajime Okumura
Abstract: In solution growth of 4H-SiC, we have investigated changes in macrostep height with addition of the Group III (B, Al, Ga), Group IV (Ge, Sn), Group V (N) elements, and transition metals (Ti, V, Cr, Ni) to Si solvents, in order to find additives improving severe step bunching which often occurs during growth. The addition of Al, B, Sn, N, and V decreased the average macrostep height compared with the crystal grown with Si solvents. The addition of Al, B, Sn, N, and V suppressed the generation of trench-shaped surface defects in long-term growth of 10 hours. This result demonstrated that the addition of Al, B, Sn, N, and V has an advantage to achieve high quality bulk crystal growth from solution.
14
Authors: Takeshi Mitani, Naoyoshi Komatsu, Tetsuo Takahashi, Tomohisa Kato, Toru Ujihara, Yuji Matsumoto, Kazuhisa Kurashige, Hajime Okumura
Abstract: We have investigated the solution growth under various Al-N co-doping conditions. Both p-type and n-type 4H-SiC were successfully grown under Al-N co-doping conditions, while using the effect of Al-addition to stabilize both growth surface and polytype. The doping and electrical properties were investigated systematically. Interaction between Al and N in the incorporation process and electrical property under heavily co-doped conditions were discussed.
9
Authors: Takeshi Mitani, Shinichi Nakashima, Masaru Tomobe, Shi Yang Ji, Kazutoshi Kojima, Hajime Okumura
Abstract: We have investigated Raman spectra of p-type 4H-SiC crystals with hole concentration ranging from 3×1016 to 1×1021 cm-3. For folded transverse acoustic (FTA) doublet modes, Fano interference profiles were analyzed, and the frequency shift due to Fano interference was obtained as a function of hole concentration. We demonstrated that the shift of the FTA doublet modes is a quantitative measure for evaluating of hole concentration of p-type 4H-SiC. Spectral features of transverse optical (TO) and longitudinal optical phonon-plasmon coupled (LOPC) modes were also studied for various carrier concentrations. The results show that the full width at half maximum of the LOPC and relative intensity of TO and the LOPC can be used as other calibration measures for hole concentration.
475
Authors: Takeshi Mitani, Masayuki Okamura, Tetsuo Takahashi, Naoyoshi Komatsu, Tomohisa Kato, Hajime Okumura
Abstract: 4H-SiC crystallization from Si-C solution in electric current-controlled liquid phase epitaxy was investigated. The dependence of growth speed on a DC current shows that dissolution/growth is controlled by the electric current without altering temperature gradient in the furnace. Application of an electric current leads to reduction of growth speed with negative polarity and enhancement of growth speed with positive polarity. The variation of the growth speed with a DC current density has been explained by the combination of the effects of electromigration of C solute and Joule heating.
3
Authors: Naoyoshi Komatsu, Takeshi Mitani, Tetsuo Takahashi, Masayuki Okamura, Tomohisa Kato, Hajime Okumura
Abstract: We have investigated growth rate and surface morphology of 4H-SiC single crystal grown from Si-C solution with various supersaturation levels at growth temperature in the range from 1840 to 2140 °C. The growth rate depends linearly on the amount of supersaturated carbon, irrespective of the growth temperature. This indicates that the growth is limited by the transfer of solute element onto the crystallization front. The adequate condition for stable solution growth are discussed with respect to high growth rate and surface morphology.
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