Authors: Avinash K. Gupta, Ilya Zwieback, Andrew E. Souzis, Murugesu Yoganathan, Thomas Anderson
Abstract: II-VI is developing large-diameter SiC crystals to be used as lattice-matched, high thermal conductivity substrates for new generation GaN-based and SiC-based semiconductor devices. Large-diameter 6H SiC single crystals are grown at II-VI using our Advanced PVT sublimation growth process. Stable SI properties are achieved by compensation with vanadium, which results in high and spatially uniform resistivity, on the order of 1011 Ohm-cm. The quality of the presently grown 100 mm 6H SI substrates has been dramatically improved [1], and they are free of edge defects. Micropipe density in the 100 mm 6H SI substrates ranges from 2 to 8 cm-2 and dislocation density from 3·104 to 6·104 cm-2. X-ray rocking curves measured on as-sawn 100 mm 6H wafers showed edge-to-edge lattice curvature () between 0.1° and 0.3° and FWHM of the rocking curve between 50 and 100 arc-seconds
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Authors: Z.Q. Fang, B. Claflin, David C. Look, L. Polenta, J. Chen, Thomas Anderson, W.C. Mitchel
Abstract: Thermally stimulated current spectroscopy (TSC) has been applied to characterize deep
traps in high-purity semi-insulating 6H-SiC substrates. By using above bandgap to sub-bandgap
light for illumination at 83 K and different applied biases, at least nine TSC traps in the temperature
range of 80 to 400 K can be consistently observed. It is found that TSC peaks for T < 130 K are
significantly affected by light and some peaks are strongly enhanced by the applied bias. Measured
trap activation energies range from 0.15 eV to 0.76 eV. Theoretical fittings of selected traps give
more accurate trap parameters. Based on literature results connected with deep traps in conductive
6H-SiC, the origin of these TSC traps is discussed.
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Authors: A. Gupta, E. Semenas, Ejiro Emorhokpor, J. Chen, Ilya Zwieback, Andrew E. Souzis, Thomas Anderson
Abstract: Over the past year, II-VI has transitioned from 2” to 3” commercial SiC
substrates. Large-diameter semi-insulating 6H-SiC and n-type 4H-SiC single crystals are
grown using the Advanced PVT growth process. Expansion of boule diameter from 2 to 3
and up to 4.25 inches has been carried out using a specially designed growth technique.
Stable semi-insulating properties in 6H-SiC are achieved by precise vanadium compensation.
The technique of compensation is optimized to produce a controlled and spatially uniform
distribution of vanadium and high and spatially uniform electrical resistivity reaching 10
10
–
1011 ·cm. N-type 3-inch 4H-SiC crystals are grown using doping with nitrogen, and 3-inch
4H-SiC substrates show uniform resistivity of about 0.018 ·cm. The best quality semiinsulating
(SI) 3” 6H-SiC substrates demonstrate micropipe density of 3 cm-2, and n-type 3”
4H-SiC substrates - about 1 cm-2. X-ray rocking curve topography of the produced 3” SiC
substrates is used for evaluation of their crystal quality.
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Authors: Thomas Anderson, Donovan L. Barrett, J. Chen, Ejiro Emorhokpor, A. Gupta, R.H. Hopkins, Andrew E. Souzis, C.D. Tanner, Murugesu Yoganathan, Ilya Zwieback
Abstract: II-VI has developed an Advanced PVT (APVT) process for the growth of
nominally undoped (vanadium-free) semi-insulating 2” and 3” diameter 6H-SiC crystals with room temperature resistivity up to 1010 W·cm. The process utilizes high-purity SiC source and employs special measures aimed at the reduction of the impurity background. The APVT-grown material demonstrates concentrations of B and N reduced to about 2·1015cm-3. Wafer resistivity has been studied and correlated with Schottky barrier capacitance, yielding the density of deep compensating centers in 6H-SiC in the low 1015 cm-3 range for both ntype
and p-type material. The nearly equal density of deep donors and deep acceptors
ndicates that the centers responsible for the intrinsic compensation can be amphoteric. TheEPR density of spins from free carbon vacancies is about 1014 cm-3. It is also hypothesized that impurity-vacancy complexes can be present in the undoped material and participate in compensation.
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Authors: Thomas Anderson, Donovan L. Barrett, J. Chen, Ejiro Emorhokpor, A. Gupta, R.H. Hopkins, Andrew E. Souzis, C.D. Tanner, Murugesu Yoganathan, Ilya Zwieback, Wolfgang J. Choyke, Robert P. Devaty, Fei Yan
Abstract: Semi-insulating 6H SiC substrates, 2”, 3” and 100mm in diameter, and n+ 4H SiC
substrates, 2” and 3” in diameter, are grown at II-VI using the Advanced Physical Vapor Transport (APVT) technique [1]. The process utilizes high-purity SiC source and employs special measures aimed at the reduction of background contamination. Semi-insulating properties are achieved by precise vanadium compensation, which yields substrates with stable and uniform electrical resistivity reaching ~ 1011 Ω-cm and higher. Conductive n+ 4H SiC crystals with the spatially uniform resistivity of 0.02 W-cm are grown using nitrogen doping. Crystal quality of the substrates, their electrical properties and low temperature
photoluminescence are discussed.
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Authors: G. Tamulaitis, I. Yilmaz, Michael S. Shur, Remis Gaska, Thomas Anderson
665
Authors: Thomas Anderson, Donovan L. Barrett, J. Chen, W.T. Elkington, Ejiro Emorhokpor, A. Gupta, C.J. Johnson, R.H. Hopkins, Charles Martin, Thomas Kerr, E. Semenas, Andrew E. Souzis, C.D. Tanner, Murugesu Yoganathan, Ilya Zwieback
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