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Articles by author: Wei Min Lin

• Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire – Wear Behaviors of Resin Bond Diamond Wheel
  Published in: Advances in Abrasive Technology XIII (p573)
• Experimental Study of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder
  Published in: Advances in Materials Manufacturing Science and Technology XIII Volume I (p17)
• Fundamentals of BK7 Glass Removal in Micro/Nano-Machining
  Published in: Advances in Abrasive Technology XII (p485)
• Proposal of a New Ultrasonic Welding Technique for Thermoplastic Polymer
  Published in: Advances in Materials and Processing Technologies (p1129)
• Simulation Investigation of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder
  Published in: Advances in Materials Manufacturing Science and Technology XIII Volume I (p23)
• Study of Dynamic Magnetic Field Assisted Finishing for Metal Mold Using Magnetic Compound Fluid (MCF)
  Published in: Advances in Precision Engineering (p258)
• Study of Three-Dimensional Polishing Using Magnetic Compound Fluid (MCF)
  Published in: Advances in Abrasive Technology XII (p288)
• Study on Tribo-Fabrication in Polishing by Nano Diamond Colloid
  Published in: Progress in Abrasive and Grinding Technology (p131)
• The Detailed Performance of MCF Polishing Liquid in Nano-Precision Surface Treatment of Acrylic Resin
  Published in: Advances in Abrasive Technology XII (p331)