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Articles by author: Xi Qu Chen

• An Analyzing on Material Removal Mechanism in Chemical Mechanical Polishing of Cu
  Published in: Advances in Grinding and Abrasive Technology XV (p354)
• Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement Trajectories
  Published in: Surface Finishing Technology and Surface Engineering (p119)
• Failure Mechanism of Twist Drill in Vibration Drilling of Duralumin
  Published in: Manufacturing Science and Engineering I (p2107)
• Study on Contact Mechanism of Interface in Wafer CMP Based on Abrasion Behavior
  Published in: Advances in Grinding and Abrasive Technology XIV (p254)
• Virtual Prototyping and Validation of an Automatic Washing Machine
  Published in: Manufacturing Science and Engineering I (p3387)