Papers by Author: Y.P. Han

Abstract: The slicing technology of hard-brittle materials by endless diamond wire saw has the advantages of higher moving speed of wire saw, better slicing quality, and thin kerf. According to the strength of wire saw, the cutting force and the random vibration of wire saw, the slicing parameters are optimized. As single crystal silicon is sliced, the constant feed force is less than 10N, the maximum pretension is 30N, and the highest moving speed of wire saw is 24m/s. But because the restrict of machine precision, the highest slicing speed is 16m/s.

Abstract: A new type of non-chisel-edge shallow-drill is developed for machining high manganese steel, which is a typical hard-to-machine material. The marked characteristic of the drill is that the cutting edge is non-chisel-edge, consisting of a section of straight line and a part of curve nearby the center. The characteristics of machining performance of this drill are analyzed. Measures adopted in design for improving cutting performance and prolonging tool life are also presented. Applied example indicates that this new drill has good cutting performances and long life. Compared with common twist drill, the axial thrust cutting force of this tool is reduced 30~50 percent.