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Articles by author: Y.Y. Earmme

• A Problem of Anisotropic/Isotropic Bimaterial with a Singularity or under a Remote Stress
  Published in: THERMEC'2003 (p3415)
• A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer
  Published in: Fracture and Strength of Solids IV (p1123)
• An Application of Conservation Integrals to Elastic T-Stresses of Interface Crack
  Published in: Fracture and Strength of Solids III (p567)
• Anisotropic and Isotropic Elasticity, and its Equivalence for Singularity, Interface and Crack in Bimaterials and Trimaterials
  Published in: Advances in Fracture and Failure Prevention (p23)
• Atomistic Simulation of the Energy Barrier for Dislocation Movement in Si
  Published in: Advances in Fracture and Materials Behavior (p957)
• Discontinuity of Stress Intensity Factor for Kinked Interfacial Crack under Anti-Plane Shear
  Published in: Fracture and Strength '90 (p397)
• Measurement of Mechanical Properties and Residual Stresses of Bridged Gold Films and Circular Gold Membranes
  Published in: Experimental Mechanics in Nano and Biotechnology (p227)
• Strength Design and Minimization of Residual Stresses in Reversible GaAs Wafer Bonding Process
  Published in: Fracture and Strength of Solids VI (p1337)
• Thermoelastic Analysis of an Interfacial Crack in Bimaterial
  Published in: Fracture and Strength '90 (p403)