Papers by Author: Yang Fu Jin

Abstract: Dual-rotating plates lapping method is a new type of ball machining technology, in which the spin axis angle of the ball could wiggle up to 180°. An investigation was made to verify the motion model of the dual-rotating plates lapping. The ball motion parameters, such as revolution speed, spin speed and spin axis angle were detected experimentally. The results show that the calculated values and the measured ones of the ball motion parameters are almost identical. The motion model of the dual-rotating plates lapping method is thus verified valid.

Abstract: A reasonable finite element (FE) model of grinding temperature field has been developed on the basis of analysis of the transient temperature field， and three kinds of boundary conditions are loaded on the element of a moving heat source. The study, which is based on the finite element principle, has been carried out using the numerical simulation software ANSYS. Many results have been obtained including three dimensional temperature distribution map. The simulated results under different conditions show good agreement with the experimental results. With the comparison of the dry-grinding and wet-grinding, the result shows that the wet-grinding temperature with a proper grinding fluid is rather lower than the dry-grinding temperature. Finally, the variable coefficient of convective heat transfer and the different form heat source have been discussed in detail.

Abstract: Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, the main parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrier rotation speed, polishing press, polishing slurries etc. , were discussed and optimized, then ultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. A new double sided polishing machine with computer control system equipped with a digital controlled press valve was developed, and the ultra-smooth machining process of silicon wafer was established in this paper.

Abstract: The functional materials such as sapphire, silicon wafer etc. are processed efficiently with ultra-smooth surface for the demand of the rapid development of the IC industry. The precise double sided polishing process is one of the main methods of getting the ultra-smooth surface for these materials. This paper introduces the structure and characteristic of the precise double sided polishing machine with a precise pressure control system equipped a new type electro-pneumatic digital servo valve. The works, such as machine design, development of the control system and optimization of process parameters etc. are carried out to meet the requirement of the precise double sided polishing machining process. This equipment has the characteristic of high machining precision and precise control capability, so it can be applied to the ultra-precise machining of the ultra-thin sapphire, silicon wafers etc.

Abstract: This paper discussed the principle about the Electrical Discharge Truing(EDT) technique ,which applied in lapping machining process, including EDT status with different environment and machining conditions, and an EDT equipment on a lapping machine have been developed and used in the experiment of EDT. Then some experiments were carried out for verifying of the EDT effect with different EDT parameters such as electric voltage, EDT gap, and the EDT media. Finally, the efficient and precision EDT was achieved with the suitable EDT parameters.

Abstract: In this paper, some molding process parameters such as injection time, packing time, packing pressure and process temperature etc. were optimized by the Computer Aided Engineering (CAE) simulation (Moldex 3D) for injection molding of a plastic lens. Some experimental trials were carried out for verifying of the CAE simulation results with checking of the lens shrinkage and birefringence etc. as well. The results showed that, the recommended molding process parameters from CAE simulation and the actual experiments were almost the same, hence the CAE is a established tool based on the scientific approach to reduce experimental works, to identify critical parameters and to save substantial costs. Lately, a perfect plastic lens was gained by the Injection–Compression Molding process with the optimized process parameters by a CAE simulation.