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Articles by author: Yu Fei Gao

• Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon
  Published in: Machining and Advanced Manufacturing Technology X (p265)
• Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing
  Published in: Advances in Grinding and Abrasive Technology XV (p306)
• Simulation and Prediction Studies on Harden Penetration Depth of AISI 5140 Alloy Steel in Surface Grinding
  Published in: Applied Mechanics And Mechanical Engineering (p1898)
• Studies of Microstructure/Critical Current Density Relationships for Grain Boundaries in YBa₂Cu₃O_7-δ Bicrystals
  Published in: Intergranular and Interphase Boundaries in Materials (p745)
• Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis
  Published in: Advances in Grinding and Abrasive Technology XV (p311)
• Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon
  Published in: Advances in Grinding and Abrasive Technology XIV (p450)
• The Numerical Analysis on Action Mechanism of Slurry in Free Abrasive Wiresaw Slicing
  Published in: Advances in Grinding and Abrasive Technology XIV (p455)