Papers by Keyword: 3C-SiC Heteroepitaxy

Abstract: In this study, a 6 inch 3C-SiC wafer has been grown and processed to realize an Al⁺-implanted layer underneath the film surface. The structural damaging has been carefully analyzed by X-Ray Diffraction (XRD) and micro-Raman spectroscopy. Raman analysis on a grazing angle polished film, after the implantation process, has been conducted and a spectral region (between 825 and 925 cm^-1) has been identified as an interesting footprint of the crystal damaging. Thermal treatments on implanted samples at doses as low as 4x10¹⁴ cm^-2 have shown a capability of the 3C-SiC crystal structure to recover from damaging. Reciprocal space mapping on (004) 3C-SiC lattice points suggests a total recovery at an annealing temperature of 1350 °C.

Abstract: SiC is a candidate material for micro- and nano-electromechanical systems (MEMS and NEMS). In order to understand the impact that the growth rate has on the residual stress of CVD-grown 3C-SiC hetero-epitaxial films on Si substrates, growth experiments were performed and the resulting stress was evaluated. Film growth was performed using a two-step growth process with propane and silane as the C and Si precursors in hydrogen carrier gas. The film thickness was held constant at ~2.5 µm independent of the growth rate so as to allow for direct films comparison as a function of the growth rate. Supported by profilometry, Raman and micro-machined free-standing structures, this study shows that the growth rate is a fundamental parameter for low-defect and low-stress hetero-epitaxial growth process of 3C-SiC on Si substrates. Stress analysis performed by modify Stoney’s equation trough optical curvature measurement, Raman shift analysis and micro-machining of free-standing structures that shows apparent disagreement about the nature of the stress. These odds between the experimental data can be explained assuming a strong stress field located in the substrate and related to defects generated in the silicon during the growth process.

Abstract: In this work we report on the study of twin boundary (TB) evolution during heteroepitaxial growth of 3C-SiC on patterned 4H-SiC(0001) substrate by vapour-liquid-solid (VLS) mechanism. Ge₅₀Si₅₀ melt was used at a temperature of 1450°C. 3C-SiC deposit was obtained on top and outside the mesas. Some lateral enlargement of these mesas was observed but it was systematically homoepitaxial. Elimination of TBs inside the 3C-SiC deposit on top of the mesas was observed for specific mesa shape and/or orientation of the sidewalls. Though three–fold or six-fold symmetry mesas are recommended for TB elimination, originally circular mesas lead also to the same result due to initial faceting toward hexagonal shape.

Abstract: A wide characterization of crystalline defects involved in the 3C-SiC heteroepitaxy on Si is here presented. The aim of this work is to show how analysis techniques, such as transmission electron microscopy (TEM) and x-ray diffraction (XRD), can help the researcher in the study of structural defects. The work is focused on stacking faults and microtwins since both of them influence the atomic stacking along the {111} 3C-SiC planes. Their distinction can indeed be troublesome. It will be shown that TEM can be helpful, by choosing a determined zone axis of observation, for defect characterization and distinction. Moreover, the impact of microtwins on the crystal quality of 3C-SiC films is studied by performing XRD pole figures. By means of this technique and simulations, we found that the <111> direction of the SiC crystal is not aligned to the <110> Si direction, but it is shifted of 3.5° along the <002> Si direction, due to second-order twinnings in the 3C-SiC crystal.