Papers by Keyword: 3D Simulation

Abstract: The Fourth Industrial Revolution, or Industry 4.0, integrates advancements in physics, digital technology, and biology to create new production capabilities and significantly impact economic, political, and social systems. Textile and garment production, a labor-intensive industry, faces particular challenges from Industry 4.0. In this context, the trend toward digitized and automated equipment—utilizing the Internet of Things (IoT), cloud computing, 3D printing, big data analytics, and artificial intelligence (AI)—is gradually replacing human labor in garment factories and throughout supply chains. To keep pace with global trends, Vietnam's textile and garment industry must adopt Industry 4.0 technologies to boost productivity, with sewing line balance being a crucial aspect of this effort. In this article, the authors present research findings on 3D simulation techniques applied to sewing lines for women’s shirts and jackets, using Tecnomatix software. They evaluate and compare the effectiveness of traditional methods for balancing sewing lines and propose improvements based on 3D simulation results. Applying these simulation techniques to real-world production is expected to enhance productivity and labor efficiency in industrial sewing lines, contributing to the development of smart garment factories in Vietnam in the Industry 4.0 era.

Abstract: Device reliability is an important factor in application, especially in the field of electric mobility. In this paper high cycle fatigue power cycling results of SiC devices in baseplate free modules are presented. To minimize testing time, the devices were stressed with load pulses corresponding to a 50 Hz load. The reliability results are the first fatigue results for temperature swings below 30 K for SiC devices. The lifetime in the high cycle fatigue area is limited by solder fatigue for high virtual junction temperatures of 150 °C. In theory, the reliability should increase exponential since the elastic-plastic transition area is reached. The experiment revealed that the lifetime can still be described by the Coffin-Manson approach also in the high cycle fatigue area. It can be observed that the high junction temperatures weaken the stability of the solder layer, so no major lifetime increase can develop. The measured temperature data are additionally corrected by a three-dimensional (3D) simulation to ensure a validity of the results.

Abstract: A comprehensive understanding of electrostatic-induced particle trapping during semiconductor wafer cleaning processes is paramount for enhancing device yield and performance. In this study, we employed a three-dimensional (3D) simulation framework to systematically analyze the interplay between electrical field strength, particle size, and electrostatic forces on particle trapping phenomena and defect pattern formation. Our findings revealed that increased electrical field strength and decreased particle size contribute to a higher probability of particle trapping and the emergence of distinct defect patterns. Based on these insights, we propose an optimization strategy to improve the cleaning process efficiency and minimize particle trapping, ultimately advancing the yield and performance of semiconductor devices.

Abstract: Indium gallium zinc oxide fin-field effect transistor (IGZO FinFET) characteristics are investigated and then compared with Zinc oxide fin-field effect transistor (ZnO FinFET) and the Silicon fin-field effect transistor (Si FinFET). This was done using 3D simulation. The threshold voltage for Si, ZnO, and IGZO is 0.75 V, 0.30 V and 0.05 V respectively. The silicon device has the highest transconductance (5.0 x 10^-7 S) and performs better than the other devices because it has less fixed charge defects. IGZO has the second-best value of Gm (3.6 x 10^-7 S), ZnO has the least value of Gm (3.4 x 10^-7 S). Si device has the least drain current (I_DS) value of 2.0 x 10^-7 A, ZnO device has a better I_DS value of 6.2 x 10^-6 A while IGZO device has the best I_DS value of 1.6 x 10^-5 A. IGZO is better than Si by two (2) order magnitude. The field effect mobility is 50.0 cm²/Vs for all three devices.

Abstract: 3D Simulation was carried out and compared with fabricated ZnO NWFET. The device had the following electrical output characteristics: mobility value of 10.0 cm²/Vs at a drain voltage of 1.0 V, threshold voltage of 24 V, and subthreshold slope (SS) of 1500 mV/decade. The simulation showed that the device output results are influenced by two main issues: (i) contact resistance (R_con ≈ 11.3 MΩ) and (ii) interface state trapped charge number density (Q_IT = 3.79 x 10¹⁵ cm^-2). The Q_IT was derived from the Gaussian distribution that depends on two parameters added together. These parameters are: an acceptor-like exponential band tail function g_GA(E) and an acceptor-like Gaussian deep state function g_TA(E). By de-embedding the contact resistance, the simulation is able to improve the device by producing excellent field effect mobility of 126.9 cm²/Vs.

Abstract: A cold forging process of Mo-alloyed sintered steel was simulated by finite element method (FEM) analysis considering density change in the process. Moreover, the effect of sintering time on the behavior of the densification and the plastic deformation of it in the cold-forging process was also investigated. Using the true stress-true strain diagram obtained by the compression test with a sintered specimen, the modified true stress-true strain diagram was derived for large plastic deformation analysis with the porous material model. The result of FEM analysis for the cold compression process of the sintered specimen revealed that the analysis can simulate the shape of the excessive metal part and density change of it. Also, it was found that local deformation becomes large and thus the excessive metal part extends with increasing sintering time although the difference in the true stress-true strain diagrams is negligible.

Abstract: Freezing is a physical treatment commonly used in operations such as drying, conservation and lyophilization of foods. In the processing and potato industries, parameters like dimension and initial moisture content of the product has a great effect on the cooling, freezing and post-freezing kinetics. Therefore, this work presents a transient three-dimensional mathematical modeling including phase change to describe the heat transfer during the process, of cooling and freezing parallelepiped foods. The governing equation was solved numerically using the finite-volume technique and a full implicit formulation. As an application, this methodology was used to describe the freezing process of potato (french-fry). Numerical results of the temperature in the center of the product were compared to the experimental data reported in the literature and a good agreement was obtained. Results of the temperature distribution inside the solid and cooling, freezing and post-freezing kinetics are presented and analyzed. It was verified that, the smaller the dimensions and lower the initial moisture content of the product, the solidification of water inside the solid occurs even faster. The largest temperature gradients were identified in the surface, close to the regions of the borders of the solid.

Abstract: Bridge pier collision avoidance system is a hot research topic. As the representative of the intelligent material, the Magnetorheological Grease has become one of the main research directions in the research of bridge pier collision due to its special mechanical properties and rheological properties. In this work, we present a bridge pier collision avoidance system using Magnetorheological Grease Material. Firstly, according to the characteristics of bridge pier collision, a series of Magnetorheological Grease Material are configured, and then the collision avoidance structure of the actual size of the bridge pier is given. The structure can be directly applied to the bridge pier collision avoidance. Secondly the experimental characteristics of the Magnetorheological Grease Material are given, and the experimental results are analyzed. The strong theoretical guidance and engineering basis were provided for the related scientific and technical workers and researchers.

Abstract: The utilization of simulation capabilities in the development process of robotic systems is already known as one standard procedure for predicting complex system behavior in a time- and cost efficient manner. eRobotics join multiple process simulation components to build "Virtual Testbeds" to provide a comprehensive tool chain and thus a holistic development. VTB may represent "mental models" of robotic systems and their environment. Therefore, they allow the development of control schemes and directly transfer simulation results for Simulation-based Control for implementing intelligent robot controls. Using Simulation-based Support, the VTBs support the ease of use of robotic systems and also the operators in their decisions. Offering an additional abstraction layer for the user, virtual representations of the robot and its environment are used to intuitively control and maneuver intelligent robotic systems. Thus, Simulation-based Control and Simulation-based Support complement each other and are promising development tools for robotic systems, individual parts thereof as well as systems in their entirety. In our contribution, we present the concepts of SbC and SbS in more detail, by examples of several complex robotic systems such as a Motion Simulator, lightweight robots and a mobile Centaur-like teleoperated robot.

Abstract: This paper develops a three dimensional (3D) simulation system with QT platform and OpenGL 3D library by adopting the driver and Aerotech’s linear motor as hardware platform and INtime and A3200 controller as the software platform. The system uses numerical control (NC) code syntax checking module to test the NC code syntax and applies 3D simulation module to display the actual machining process. The interference and collision detection module is built in this system to detect the problem during the actual processing. The system therefore contributes to avoiding the trial and tests for the ultra-precision machining process and improving the machining efficiency as well as reducing the loss of ultra-precision components of machine tool due to the collision.