Papers by Keyword: 3D Topography

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Abstract: Optical profiler is employed to acquire topography height data of ball-end milled die steel surface under different spindle speeds ranging from 2000rpm to 12000rpm with lead angle of 20° and tilt angle of-10°. By multi-scale wavelet analysis, measured height data are decomposed and then been reconstructed, meanwhile 3D topography and 3D roughness in different frequency bands are obtained. The results show that the changing trend of roughness with frequency band under different spindle speeds is not the same. In the high frequency bands, roughness has a tendency to increase with the increasing spindle speed. In the median frequency band, the roughness of the surface machined under low spindle speed 2000 rpm is the largest and the roughness of the surface machined under high spindle speed 12000 rpm is the lowest. In the low frequency bands, the roughness of the surface machined under low spindle speed 2000rpm is much larger than those obtained under other spindle speeds, and with the increasing spindle speed, the changing trend of roughness increases firstly then decreases.
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Abstract: Among the properties of polishing pad, the surface roughness plays a crucial role in CMP (Chemical Mechanical Planarization) process. However, there is no acknowledged standard for measuring and characterizing the roughness of pad surface in 3D measurement. In this paper Talysurf CLI 2000 working on the principle of dynamic confocal measurement was initially suggested to measure the 3D surface topography of polishing pads through theoretical and experimental analysis. In addition, based on the Nyquist folding frequency and the statistical theory, a selection technique for sampling interval and sampling area was proposed and verified through experiments. The results showed that Talysurf CLI 2000 is more suitable than NewView to measure the 3D surface topography of polishing pads. 2μm sampling interval, 0.5×0.5mm2 sampling area and 10μm interval, 1×1mm2 area are respectively recommended for IC1000/SubaIV and SubaIV polishing pad.
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