Papers by Keyword: AID

Abstract: This paper presents a novel method for elimination of cast shadow and water tailing in rainy highway videos. Based on color and texture characteristics of vehicles, background, cast shadow and water tailing region, a fusion method is proposed. First, color correlation is estimated between pixels through dot product of HSI vectors. Second, the texture difference based on gradient of current region and background region is calculated. Then, these two results are fused to both eliminate cast shadow and water tailing region. Experiments show that our method is simple and efficient, also helpful to extract accurate traffic information.

Abstract: The abrasive ice disc chemical mechanical polishing (AID-CMP) is a potential polishing process in the semiconductor industry to realize superior surface finish and planarity for semiconductor wafers. In this paper we investigated the temperature field during GaAs wafer AID-CMP process for a better understanding of AID-CMP. The results show that the AID outer temperature is higher than the inner, and the highest temperature in AID is at the wafer/AID contact zone. The increases of Pc, v, eh and tp will generate more energy and cause more local melting during GaAs wafer AID-CMP process. The AID temperature and the area of highest temperature zone increase with increasing Pc, v, and eh. The nodes temperature increase in every conditions adopted as tp increases. The area of melted zone and thickness of melted ice increase with increasing Pc, v, eh and tp.