Papers by Keyword: Abrasive-Free Polishing

Abstract: The authors developed “Dynamic Friction Polishing (DF polishing) Method” utilizing a thermochemical reaction between a diamond workpiece and a metal. This method enables high efficiency abrasive-free polishing of single crystal and polycrystalline diamonds (PCD) by simply pressing them against a stainless steel (SUS304) disc rotating at a high peripheral speed (V_S>2500m/min). In the authors’ previous paper, a top of the diamond test piece (0.6mm×0.6mm, (100) plane) was removed at a rate of 2.6mm/min (0.94mm³/min) under the polishing condition of sliding speed V_S=4000m/min, loading pressure P=130MPa and polishing time t=10s. A bottleneck for practical use of this method is a high pressure over 100MPa required for pressing a diamond workpiece against a rotating stainless steel disc. In this paper, a high efficiency tool was manufactured by electro-spark deposition of highly reactive special metals on a base disc tool. Among various reactive metals Nb and W brought very high efficiency in the polishing of a single crystal diamond.

Abstract: With high requirement setting for hard disk substrate surface quality, abrasive-free polishing (AFP) has attracted more researchers’ attention. In this paper, the influence of Mn (Ⅱ) ion on AFP of hard disk substrate in the H₂O₂ based slurry was investigated. The experiments results show that Mn (Ⅱ) ion can effectively increase the material remove rate (MRR) and improve the planarization of hard disk substrate. Furthermore, the acting mechanism of Mn (Ⅱ) ion in AFP of hard disk substrate was analyzed. The electron spin-resonance spectroscopy (EPR) analysis shows that Mn (Ⅱ) ion in the H₂O₂ based slurry not only can increase the concentration of ·OH free radical, but also can make H₂O₂ decompose to ·O₂^– free radical. These free radicals can accelerate the chemical etching and increase the MRR of hard disk substrate.