Papers by Keyword: Basal Plane Dislocation (BPD)

Abstract: In this paper, we found origin of V_F degradation of SiC bipolar devices other than a basal plane dislocation (BPD) in the SiC substrate. A V_F degradation of the 4H-SiC PiN diodes with low-BPD wafers was evaluated and its origins were discussed. Some diodes suffered V_F degradation, even though they were fabricated on BPD-free area. PL mapping, TEM image, and optical observation after KOH etching showed that there were Shockley stacking faults and combined etch-pits arrays, which were presumed to be caused by the device process.

Abstract: For bulk growth of SiC crystal with higher quality, it is important to control the temperature distribution inside the crucible. We have performed numerical calculations of the temperature distribution inside the growing crystal, and discussed the relationship between the calculated sheer stress and the basal plane dislocation densities. We found that growth with lower basal plane dislocation defect densities, specifically at the front edge of the crystal, is possible by lowering the temperature gradient toward the growth direction.

Abstract: Basal plane dislocations (BPDs) converting to threading edge dislocations (TEDs) has been observed in 4H-SiC epilayers after thermal annealing at high temperatures. Grazing incidence reflection synchrotron X-ray topography was used to investigate the dislocation behaviors. It is argued that the conversion is achieved by constricted BPD segments cross-slipping to the prismatic plane and TED glide on its slip plane. Higher conversion ratio and better surface morphology were achieved by performing ion implantation and annealing before epitaxial growth.

Abstract: Morphologies of basal plane dislocations (BPDs) in 4H-SiC epilayers doped with nitrogen or aluminum are explained in detail. While BPDs in low N-doped or Al-doped epilayers show the morphology of gliding dislocations responding to stresses, BPDs in highly N-doped (≥1.0×10¹⁸ cm^-3) epilayers appear different. Some of them are parallel to [11-20] while others are straight and tilt from [11-20]. Tilt BPDs were also studied by TEM. Factors that relate to such morphology are discussed.

Abstract: This paper demonstrates the X-ray three-dimensional topography of basal-plane dislocations (BPDs) and threading edge dislocations (TEDs) in 4H-SiC. Cross-sectional imaging shows the propagation of BPDs from a substrate to an epilayer and the conversion of BPDs into TEDs near the epilayer/substrate interface. The strain analysis of TEDs exhibits the image of strains in the order of ±10-5. The observed strain images correlate well to simulation results.

Abstract: The effects of Shockley stacking faults (SSFs) that originate from half loop arrays (HLAs) on the forward voltage and reverse leakage were measured in 10 kV 4H-SiC PiN diodes. The presence of HLAs and basal plane dislocations in each diode in a wafer was determined by ultraviolet photoluminescence imaging of the wafer before device fabrication. The SSFs were expanded by electrical stressing under forward bias of 30 A/cm², and contracted by annealing at 550 °C. The electrical stress increased both the forward voltage and reverse leakage. Annealing returned the forward voltage and reverse leakage to nearly their original behavior. The details of SSF expansion and contraction from a HLA and the effects on the electrical behavior of the PiN diodes are discussed.

Abstract: This paper demonstrates the X-ray three-dimensional (3D) topography of basal-plane dislocations (BPDs) and threading edge dislocations (TEDs) in 4H-SiC for the first time. Stereographic topographs are obtained for BPDs and TEDs, showing the propagation of BPDs from a substrate to an epilayer and the conversion of BPDs into TEDs near the epilayer/substrate interface. Strain analysis is also demonstrated for a TED, providing the image of strains in the order of ±10-5. It is verified that the 3D topography is successfully applicable to BPDs and TEDs.

Abstract: Shockley stacking fault (SSF) contraction in 4H-SiC was investigated, in-situ, under varying temperature and ultraviolet (UV) intensity. Contraction of single SSFs at room temperature was observed for the first time under low power UV excitation of 0.04 W/cm². At temperatures above 150 °C, complete SSF contraction occurred for UV power at 0.2 W/cm². In contrast to expansion, SSF contraction occurred in discrete jumps between pinning sites along existing C-core partials. Luminescence from the pinning sites suggest they may be local concentrations of point defects. Additionally, a change in the line direction of the Si-core partials by ~25o off the direction was observed.

Abstract: Morphological features, such as the orientation and linearity of basal plane dislocations (BPDs) in SiC crystals, were analyzed by applying a two-dimensional fast Fourier transform (2D-FFT) to X-ray topographic images of the BPDs. An SiC crystal fabricated by an improved repeated a-face (RAF) method and an SiC crystal fabricated by an conventional RAF method discussed in a previous study were evaluated. In the 2D-FFT images of the improved crystal, streaks along the directions were observed, indicating that the BPDs were highly oriented along the directions. The degree of orientation of the BPDs, which may reflect their linearity, was calculated, and the improved RAF crystal had a much higher degree of orientation than the conventional RAF crystal.

Abstract: Morphologies of BPDs in 4H-SiC epilayers with different nitrogen doping concentrations are explained in detail. While BPDs in low-doped epilayers have the typical morphology of gliding dislocations responding to stress, BPDs in highly doped ([N]≥1.0×10¹⁸ cm^-3) epilayers are straight and tilt away from [11-20]. Structures of BPDs are further studied by weak-beam TEM.