Papers by Keyword: Brazed

Paper TitlePage

Abstract: An investigation is reported of the relationships of the temperatures and grinding parameter for grinding of ceramics with a brazed diamond grinding tool. During the experiments, the temperature distributions along the workpiece surface were measured using a foil thermocouples and the energy partition to the workpiece estimated using a temperature matching method. The results show that the grinding temperature increased with the increasing of worktable feed rate or tool velocity and depth of grinding. The measured temperature responses were found to be in good relation with the analytical results of a moving heat source with a rectangular distribution at the grinding zone.The energy partition ε is about 23%.
8
Abstract: In this study, two different arrangement lapping disks fixed with brazed diamond pellets were used to lap silicon wafer and alumina ceramic. The effects of the surface morphology, roughness, and removal rate of workpiece caused by lapping pressure, lapping time, workpiece velocity, and disc arrangement were operated with serials experiments. The results of the researches provided guidance for fixed abrasive lapping of hard and brittle materials with the brazed micro powder diamond disk.
451
Abstract: A new high frequency induction brazed monolayer diamond wire saw for cutting aluminum alloy thick plate is developed with the helical continuous cutting edge distance on the wire surface. In order to solve the problems of forming cutting aluminum alloy plates,the brazed diamond wire saw is used to conduct the preliminary cutting tests on the 50 mm aluminum alloy plates on the modified grinder experimental platform.The results indicate that the cutting efficiency of the brazed diamond wire saw is increased with the increasing of the feed tension, the wire saw line speed and the diamond grits size. Furthermore, some cutting chips shape of the aluminum alloy is presented based on experimental cutting.
218
Abstract: An investigation was undertaken to explore the grinding energy and removal mechanisms in grinding zirconia by using brazed diamond wheels. The grinding forces were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that material removal mechanisms are dominated by the combined removal modes of brittle and ductile. The prevailing removal mechanism for the ground surface of zirconia changes from brittle to ductile when the maximum chip thickness change from large to small.
80
Abstract: Fixed-abrasive wire saw, with its ability to cut hard brittle material, such as silicon ingots, crystals and quartz, has emerged as a leading technology for production in semiconductor and photovoltaic industry. There are some defects in conventional fixed-abrasive wire saw such as significant low holding abrasive ability, low machining efficiency, high running costs, etc. A new fixed-abrasive wire, namely brazed diamond wires have been developed to overcome these problems. In this paper, brazed diamond wire were carried out to braze two different size diamond grits onto two different thin steel wires by using a nickel-based powder as brazing alloy. The mechanical properties of brazed diamond wire were evaluated by tensile and breaking twist experiment. The experimental results showed that the heating in the brazing process has litter influence on the wire mechanical properties. The addition of brazed alloy and diamond grits sharply decreased the wire mechanical properties significantly, both in the tensile strength and breaking twist angle. Bigger diamond grit would make the accumulation of brazed alloy which leaded to the deterioration of diameter consistency of wires.
294
Abstract: The mechanics behaviors on three-point bending of brazed aluminum honeycomb panel by FEM are investigated in this paper. The results show that honeycomb panel have three typical failure modes under bending load:failure of honeycomb core collapse, the whole panel bending failure and face sheet shear failure. Honeycomb lateral bending failure load is greater than the longitudinal bending failure load. When the ratio of honeycomb core thickness and panel thickness is between 10% to 15%, the strongest cellular panel bending occurs.
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