Papers by Keyword: CAE System

Abstract: The quality of the plastic part depends on the material characteristics, the mold design, and the process parameters, one of which is more important. It involves many sub-design tasks that determine the cost and performance in the early conceptual mold layout design phase. Base-Cover was injection molded with acrylonitrile–butadiene–styrene (ABS)/polycarbonate (PC) [ABS/PC] alloy resin and its process parameters was analyzed by commercial Moldflow software. The optimum gate location and melt filling time were determined, and the optimum injection temperature was obtained by analyzing the shrinkage of the product after molding. An effective regression model was developed to determine the mathematical relationship between the process parameters (mold temperature, melt temperature, injection pressure, injection time, and cooling time) and the volumetric shrinkage by utilizing the analysis data.

Abstract: The ADVENTURE project started as one of the research projects in the "Computational Science & Engineering" field selected for the "Research for the Future" Program sponsored by the Japan Society for the Promotion of Science during 1997-2002. Since March 2002, the project has continued as an independent project. In the project we have been developing an advanced general-purpose computational mechanics system, named ADVENTURE, running in various kinds of parallel and ditributed environments. The system is designed to be able to analyze a three-dimensional finite element model of arbitrary shape with 10-100 million DOFs mesh, and additionally to enable parametric and non-parametric shape optimization. The first version of the system has been released from the project website as open source software since March, 2002. 2,049 registered users in academia and industries have downloaded 12,827 modules and been using them, while one company has developed and released its commercial version named ADVENTUREcluster. The ADVENTURE system has been successfully implemented in various types of parallel and distributed environments including PC clusters, massively parallel processers such as Hitachi SR8000/MPP and the Earth Simulator, and Grid environments such as ITBL (IT-based Laboratory). The system has been successfully applied to solve various real world problems such as response of a full scale nuclear pressure vessel model and thermoelastic deformation of full scale electric mounting board of a mobile PC.