Authors: Rong Guang Jia, Chong Hong Zhang, Xin Fu, Tong Da Ma
Abstract: CBED and EELS are most common methods to determine the thickness of the TEM specimen. In this work, specimen thickness of He-ion irradiated Al is measured respectively by CBED and EELS under 200kV. The helium concentration and the atomic displacement damage level are 2000appm and 0.2dpa, respectively. The CBED results show that the measurements of extinction distance match the calculations of effective extinction distance considering the deviation vector of the crystal. Moreover, it is proven by modeling analysis that He-ion irradiation does not affect the thickness measurements of extinction distance. Compared with CBED, the specimen thickness, measured by EELS, is larger, and may be attributed to the decrease of the zero-loss peak due to a part of elastic scattering electronsloss and the larger inelastic scattering mean free path selected. The EELS measurement error is less than 20%,consistent with the accuracy (about 20%) byK. Iakoubovskiiet al.
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Authors: Oliver J. Weiss, Ermile Gaganidze, Jarir Aktaa
Abstract: The objective of this work is to evaluate the microstructure of the neutron-irradiated reduced activation ferritic/martensitic (RAFM) steel EUROFER 97. For this purpose irradiation induced defects like defect clusters, dislocation loops, voids/bubbles and precipitates are identified by transmission electron microscopy (TEM) and quantified in size and volume density. Emphasis is put on analyzing the influence of the irradiation dose and neutron fluxe on the evolution of size and density of the defects at irradiation temperatures between 300 and 335 °C.
A first sample irradiated to a dose of 31.8 dpa was analyzed. The irradiation was carried out in the BOR 60 fast reactor of JSC “SSC RIAR” in Dimitrovgrad, within the framework of the ARBOR-1 irradiation program. To study the dose dependence in a next step the results will be compared to quantitative data on samples irradiated to a dose of 15 dpa.
The obtained quantitative data will be used for correlation of the changes in the microstructure to the changes in the mechanical properties and will serve as an input for models describing this correlation.
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Authors: Keisuke Kobayashi, Toshimasa Suzuki, Youichi Mizuno
Abstract: The nanoscale local structure of core-shell structured BaTiO3 grains with a nonuniform dopant
distribution was studied by convergent beam electron diffraction. The direct measurements of the
variation of lattice parameter in an individual BaTiO3 grain were achieved. It was found that the
lattice parameter continuously increased from inside the grain core to the grain shell and there was
no discontinuity at the core/shell interface. The increasing gradient of c-axes was slightly smaller
than that of a-axes, suggesting that the perovskite unit cell in the grain shell has lower tetragonality.
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Authors: J.W. Lee, Cheol Woong Yang
Abstract: We investigated the phase transformation and thermal stability of Ni silicides formed in
Ni/Si and Ni0.95Ta0.05/Si systems. The sheet resistance values of the silicide in the Ni0.95Ta0.05/Si
system were lower than those in Ni/Si system at any temperature. The enhancement of thermal
stability is closely related to the phase transformation occurred during post heat-treatment. Microstructure
of the phases formed by reaction was investigated by analytical electron microscopy (AEM)
and the phase identification of Ni silicide was carried out using convergent beam electron diffraction
(CBED) technique. It was found that a Ta rich layer formed on the top of the Ni silicide layer and
small amount of Ta dissolved into the silicide layer. By addition of Ta atoms, phase transformation
from NiSi to NiSi2 is retarded and thermal stability of Ni silicide is improved.
45
Authors: J.K. Choi, H.B. Kang, J.W. Lee, Seung Boo Jung, Cheol Woong Yang
Abstract: Interfacial reaction between electroless plated Ni-P/Au UBM(Under Bump Metallization and eutectic Sn-58mass%Bi solder was studied by using AEM(Analytical Electron Microscopy). UBM is prepared by the electroless plating of Au (0.15μm ) / Ni-15at%P (7 μm ) on bare Cu substrate, and then it is reacted with Sn-58Bi solder at 220°C for 1 min. The chemical analysis using AEM
provided us very consequential information about microstructure of the interface and phases formed. CBED(Convergent Beam Electron Diffraction) technique is used for phase identification of intermetallic compounds. In this study, the AEM results indicate that Ni3Sn is formed at the P-rich Ni layer/Ni3Sn4 interface by crystallographic analysis. The measured primitive cell volume(104.10 Å3)of this phase is close to the Ni3Sn(103.19 Å3) rather than Ni2SnP(235.24 Å3).
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Authors: Guo Xun Liu, Zhuo-Ming Guan
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Authors: Z. Zhang, Y.F. Yan, H. Zhang, R. Wang
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