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Articles by keyword: «CMP»

• A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process
  Published in: Advances in Abrasive Technology VI (p433)
• A Review on the CMP of SiC and Sapphire Wafers
  Published in: Advances in Abrasive Technology XIII (p429)
• A Study of the Characteristics of the Diamond Dresser in the CMP Process
  Published in: Advances in Abrasive Technology VI (p371)
• A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method
  Published in: Advances in Abrasive Technology VI (p413)
• A Suspending Abrasives and Porous Pad Model for the Analysis of Lubrication in Chemical Mechanical Polishing
  Published in: Advances in Machining & Manufacturing Technology VIII (p775)
• An Alkaline SiO₂ Slurry for Fine Atomizing CMP
  Published in: Mechanics, Solid State and Engineering Materials (p258)
• An Improved Architecture for Multi-Core Prefetching
  Published in: Manufacturing Engineering and Process (p253)
• Applications of Tetramethylammoninium Hydroxide (TMAH) as a Post Tungsten CMP Cleaning Mixture
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p105)
• Augmented CMP Techniques for Silicon Carbide
  Published in: Silicon Carbide and Related Materials 2005 (p1099)
• Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container
  Published in: Advances in Precision Engineering (p61)
• Biodegradation and Characterization of Phase Separated NaCa(PO₃)₃ and KCa(PO₃)₃ from Pure Ca(PO₃)₂
  Published in: Bioceramics 18 (p211)
• Biodegradation Study of Amorphous and Crystalline Calcium Metaphosphate in the SBF and Tris-Buffer Solution
  Published in: Bioceramics 13 (p131)
• Challenges of High-Performance and High-Reliablity in SiC MOS Structures
  Published in: Silicon Carbide and Related Materials 2011 (p703)
• Characteristics of High Rotational Speed Polishing with Oscillation Speed Control
  Published in: Advances in Abrasive Technology VIII (p355)
• Characterization of Wafer Surface Topography after CMP
  Published in: New Materials and Processes (p2603)