A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process

Authors: D.H. Lee, D.J. Kwon, Yi Koan Hong, Jin Goo Park

A Review on the CMP of SiC and Sapphire Wafers

Authors: Yong Guang Wang, Liang Chi Zhang

A Study of the Characteristics of the Diamond Dresser in the CMP Process

Authors: Yunn Shiuan Liao, P.W. Hong, C.T. Yang

A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method

Authors: Jae Young Choi, Hwan Kim, J. Park, S. Chung, Hae Do Jeong, M. Kinoshita

A Suspending Abrasives and Porous Pad Model for the Analysis of Lubrication in Chemical Mechanical Polishing

Authors: J.Y. Liu, Dong Ming Guo, Zhu Ji Jin, Ren Ke Kang

An Alkaline SiO₂ Slurry for Fine Atomizing CMP

Authors: Jing Zhai, Zi Feng Ni, Qing Zhong Li

An Improved Architecture for Multi-Core Prefetching

Authors: Juan Fang, Hong Bo Zhang

Applications of Tetramethylammoninium Hydroxide (TMAH) as a Post Tungsten CMP Cleaning Mixture

Authors: M. Jolley

Augmented CMP Techniques for Silicon Carbide

Authors: Peter Kuo, Ian Currier

Basic Characteristics of a Simultaneous Double-Side CMP Machine, Housed in a Sealed, Pressure-Resistant Container

Authors: Kei Kitamura, Toshiro K. Doi, Syuhei Kurokawa, Yoji Umezaki, Yoji Matsukawa, Yota Ooki, Tadashi Hasegawa, Isamu Koshiyama, Koichiro Ichikawa, Yoshio Nakamura