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CONFERENCE
6/16/2013 - 6/19/2013
The 7th International conference on Physical and Numerical Simulation of Materials Processing
5/16/2013 - 5/19/2013
2nd International Congress on Advanced Materials
4/13/2013 - 4/14/2013
2013 2nd lnternational Conference on lntclligent Materials, Applied Mechanics and Design Science (IMAMD 2013)
more...
Articles by keyword: «
Chemical Mechanical Polishing (CMP)
»
105 papers on 7 pages:
1
[2]
[3]
...
[7]
[next]
A Comparison of Various Surface Finishes and the Effects on the Early Stages of Pore Formation during High Field Etching of SiC
Published in:
Silicon Carbide and Related Materials 2005
(p743)
A Dishing Model for Chemical Mechanical Polishing of Plug Structures
Published in:
Advances in Abrasive Technology XIII
(p276)
A Fine Atomization CMP Slurry for Copper
Published in:
Mechanics, Solid State and Engineering Materials
(p271)
A Material Removal Modeling of Chemical Mechanical Polishing Based on Micro-Contact Mechanism
Published in:
Advanced Materials and Computer Science
(p472)
A Method to Improve Uniformity of Material Removal of Chemical Mechanical Polishing in LCOS Process
Published in:
Optics Design and Precision Manufacturing Technologies
(p686)
A Model of CMP about Magnetic Fluid and its Numerical Simulations
Published in:
Advances in Engineering Design and Optimization II
(p333)
A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process
Published in:
Precision Machining of Advanced Materials
(p25)
A Preliminary Model Accounting for the Suction Pressure in CMP Process
Published in:
Progresses in Fracture and Strength of Materials and Structures
(p737)
A Study on Surface Quality of GaN with CMP Polishing Process
Published in:
Materials Processing Technology
(p1764)
A Study on the Dressing Rate in CMP Pad Conditioning
Published in:
Advances in Abrasive Technology VI
(p377)
A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method
Published in:
Advances in Abrasive Technology VI
(p413)
A Three-Dimensional Hydrodynamic Lubrication Model for Chemical-Mechanical Polishing Considering Pad Roughness
Published in:
Frontiers of Manufacturing and Design Science
(p1213)
Amorphous Diamond Dresser for CMP Fixed Abrasives Pad
Published in:
Advances in Abrasive Technology IX
(p157)
An Analyzing on Material Removal Mechanism in Chemical Mechanical Polishing of Cu
Published in:
Advances in Grinding and Abrasive Technology XV
(p354)
An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel
Published in:
Ultra-Precision Machining Technologies
(p98)
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