Scientific.Net: Materials Science

Paper Title	Page
A Comparison of Various Surface Finishes and the Effects on the Early Stages of Pore Formation during High Field Etching of SiC Authors: Yue Ke, Catherine Moisson, S. Gaan, R.M. Feenstra, Robert P. Devaty, Wolfgang J. Choyke	743
A Dishing Model for Chemical Mechanical Polishing of Plug Structures Authors: Shih Hsiang Chang	276
A Fine Atomization CMP Slurry for Copper Authors: Hui Zhang, Zi Feng Ni, Qing Zhong Li	271
A Material Removal Modeling of Chemical Mechanical Polishing Based on Micro-Contact Mechanism Authors: Shi Wen Du, Yong Tang Li, Jian Jun Song, Hui Ping Qi	472
A Method to Improve Uniformity of Material Removal of Chemical Mechanical Polishing in LCOS Process Authors: Yu Hui Sun, Ren Ke Kang, Dong Ming Guo	686
A Model of CMP about Magnetic Fluid and its Numerical Simulations Authors: Yong Zhou Li, Xiao Ping Fan, Qiu Yun Zheng	333
A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process Authors: Junji Watanabe, R. Etoh, M. Hirano	25
A Preliminary Model Accounting for the Suction Pressure in CMP Process Authors: Chao Hui Zhang, Jian Bin Luo, Qiu Ying Chang	737
A Study on Surface Quality of GaN with CMP Polishing Process Authors: Wei Li, Ming Ming Ma, Bin Hu	1764
A Study on the Dressing Rate in CMP Pad Conditioning Authors: Pei Lum Tso, S.Y. Ho	377

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