Papers by Keyword: Circular Translational Polishing (CTP)

Abstract: The exposure quality was influenced by focal length, zoom, irradiating power and cylinder speed of laser head in computer-to-plate (CTP) process. This paper determined the most optimal parameters which used screen thermal sensitive device PT-R4100 by changing the focal length, zoom, irradiating power and cylinder speed of laser head. Adjusted the setting parameters in order to divide the CTP plate into 13 test strips and each strip was divided into 13 small test pieces. This method could determine the most clear image teat strip by observing and measuring color and density of the test strips or test pieces, and then calculated the most optimal parameters. The results showed that this method could determine the parameters quickly and accurately. The most optimal parameters of focal length, zoom, irradiating power and cylinder speed in CTP process were 1500 puls, 6700 puls, 90%, 600r/min respectively。

Abstract: The average Reynolds equation and average clearance equation of circular translational polishing (CTP) under the quasi-stable mixed lubrication state are set up in polar coordinates. The distributions of fluid pressure and contact pressure during polishing are numerically analyzed by solving simultaneously these equations along with the contact pressure equation. The effects of various process parameters on hydrodynamic performance of CTP are analyzed. By comparing the distributions of periodic average pressure along radial direction under fully and partially lubricated states, we conclude that carefully controlled CTP under mixed lubrication is beneficial to improving the surface quality and planarity of the wafer.