Papers by Keyword: Copper Alloy Sheet

Abstract: The diffusion bonding of Ti to Ti, Ti-Cu alloy at different temperatures ranging from 673 K to 923 K under an applied stress of 100 MPa for 1 h was studied. The observation of the microstructure reveals that sound joints between the Ti-Ti and dissimilar titanium/Copper metals sheet were successfully joined by diffusion bonding process. Ti-Cu alloy without any pores or cracks can be achieved through diffusion bonding at temperatures over 873 K under the applied stress of 100 MPa for 1 h. The bond is composed of the zones, and its width increases with the increase of bonding temperature. The Micro hardness at the interface of joints bonded under different conditions was evaluated through Micro hardness testing and the fracture mode was analyzed by SEM observation.

Abstract: By using the finite element method and large strain two-dimension plane strain model, the flaking damage of Cu-Fe-P lead frame sheet is investigated. The characterization of microstructure under surface flaking is the larger Fe particles embedded in the copper matrix. The numerical analysis reveals that at the interface of Cu and Fe there are greater strain mutation and intense stress concentration that is increased with particle diameter and the extent of deformation. This strain and stress concentration makes the interface initiate crack and develop crack easily. The micro-crack around the Fe particle is also attributed to surface flaking damage under the finish rolling deformation. The larger Fe particles should be avoided in the production of Cu-Fe-P alloy.