Papers by Keyword: Copper Corrosion

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Abstract: Lacquered copper membranes are sometimes used in operate equipment containing low aggressive corrosive water-based fluids. In some cases, the lacquer coating does not prevent the occurrence of corrosive processes leading to through damage to the product and equipment failure. In this work, a review of the most common copper corrosion mechanisms is carried out. During a visual inspection of the products, the peculiarities of the state of the membrane surfaces and corrosive damage were noted. On the basis of metallographic, X-ray structural and electrochemical studies, the assumptions put forward at the stage of visual inspection were confirmed. The conclusions contain assumptions about the reasons for the formation of pitting corrosion on copper membranes.
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Abstract: This study investigates the effect of water flowrate on the copper alloy corrosion by using a hydrodynamic corrosion test in operating conditions of water flow rate range between 0.05 and 3.5 m/s, the temperature range between 20 and 45 °C. Dissolved oxygen concentration was in the range between 6.1 and 9.2 mg/l. The effects of water properties density, viscosity, and the tube geometric dimensions also considered. Corrosion rate determined by the weight loss calculation method and the tested samples microstructures characterized using FESEM. The results showed that the copper surface layer more affected by water flow at the beginning of turbulent flow condition, while at fully developed turbulent flow condition the surface covered with a fixed oxide layer. Therefore, corrosion found to be at higher rates during the initial stage of the turbulent flow condition, but it reduced at fully developed turbulent flow conditions at higher water velocity. These results indicate that the overall flow rate conditions, which include physical properties of the fluid, hydrodynamic parameters, and the geometric tube dimensions, have the dominant influence on corrosion rate.
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Abstract: This paper chose triadimenol as a corrosion inhibitor of copper in 0.5mol/L sulfuric acid. The properties of corrosion inhibition were investigated by the polarization measurement and electrochemical impedance spectroscopy (EIS). Polarization curves showed that both cathodic and anodic processes of copper corrosion were suppressed. The inhibiting efficiency increased as the increment of the inhibitor concentration and reached 86.7% at 50 mg/L. The results obtained from EIS measurements are in line with that obtained from potentiodynamic polarization. Finally, a mechanism of inhibition is proposed and discussed.
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