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Articles by keyword: «Copper (Cu)»

• A Combined Positron Microprobe - Scanning Electron Microscope for Positron-Annihilation Spectroscopy with a Spatial Resolution in the Micron Range
  Published in: Positron Annihilation - ICPA-11 (p641)
• A Dual Role of Copper on the Surface of Bone Implants
  Published in: THERMEC 2009 (p600)
• A Facile Method of Surface Modification Based on the Adhesive Behavior of Poly(dopamine) on Copper
  Published in: Multi-Functional Materials and Structures II (p2155)
• A Hydrogenated Water Application to Semiconductor Manufacturing
  Published in: Ultra Clean Processing of Silicon Surfaces V (p71)
• A Model for Multi Peak Dynamic Recrystallization in Copper
  Published in: Fundamentals of Deformation and Annealing (p565)
• A Multiscale Deformation Analysis for Mono-Crystalline Copper under Dynamic Uniaxial Tension
  Published in: Frontiers in Materials Science and Technology (p241)
• A New Chelating Sorbent for Removal of Copper (II) in Corrosion Mechanism and Pollutant Ions
  Published in: Corrosion, Processes and Advanced Materials in Industry (p91)
• A new Insight into the Electromigration Behavior of Copper Interconnects: The Roles of Grain Boundary and Surface Diffusion
  Published in: Diffusion in Materials DIMAT 1996 (p1673)
• A Novel Copper Interconnection Cleaning by Atomic Hydrogen Using Diluted Hydrogen Gas
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p389)
• A Novel Surface Cleaning for Copper Interconnection Using Ammonium Decomposed Species Generated by Hot Wire
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p307)
• A Study of Basic Characteristics of Polishing Using Particle-Type Electro-Rheological Fluid
  Published in: Advances in Abrasive Technology IX (p201)
• A Study of the Copper-Pair Related Centers in Silicon
  Published in: Defects in Semiconductors 19 (p467)
• A Study of the Early Stages of Recovery in Cold Rolled {110}<001> Oriented Copper Single Crystals
  Published in: Textures of Materials - ICOTOM 14 (p761)
• A Study on Co and Cu Oxides as Sintering Aids for Sm_0.2Ce_0.8O_1.9 Electrolyte
  Published in: THERMEC 2006 (p1391)
• A Study on the Initial Stages of Oxidation of Copper In Alkaline Solution by Electrochemical and XPS Analysis
  Published in: Electrochemical Methods in Corrosion Research V (p207)