| Paper Title | Page |
|---|---|
|
A Study of Basic Characteristics of Polishing Using Particle-Type Electro-Rheological Fluid Authors: Takeshi Tanaka |
201 |
|
A Study of the Copper-Pair Related Centers in Silicon Authors: Andrei A. Istratov, T. Heiser, H. Hieslmair, C. Flink, Joachim Krüger, Eicke R. Weber |
467 |
|
A Study of the Early Stages of Recovery in Cold Rolled {110}<001> Oriented Copper Single Crystals Authors: Michael Ferry, John F. Humphreys |
761 |
|
A Study on Co and Cu Oxides as Sintering Aids for Sm0.2Ce0.8O1.9 Electrolyte Authors: Xin Ge Zhang, Cyrille Decès-Petit, Sing Yick, Mark Robertson, Wei Qu, Yong Song Xie, Rob Hui, Edward Styles, Justin Roller, Olivera Kesler, Radenka Maric, Dave Ghosh |
1391 |
|
Authors: G. Capobianco, P. Fabris, A. Glisenti, G. Granozzi |
207 |
|
A Technique for Delineating Defects in Silicon Authors: Luciano Mule'Stagno |
753 |
|
A Theoretical Study of Copper Contaminated Dislocations in Silicon Authors: N. Fujita, R. Jones, Sven Öberg, Patrick R. Briddon, A.T. Blumenau |
259 |
|
Authors: Alexei Vinogradov, V. Patlan, Kazuo Kitagawa |
607 |
|
Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding Authors: Hiroshi Kawakami, Toshiharu Kawabe, Jippei Suzuki |
3297 |
|
Activation Volume in Fine Grained Metals from Stress Relaxation and Nano-Indentation Authors: Yannick Champion, Sophie Nowak |
399 |