Effects of Grain Size on Fatigue Crack Propagation in Copper Film

Authors: Kenichi Shimizu, Tashiyuki Torii

Fatigue Properties of Nanometer-Scale Copper Films

Authors: Bin Zhang, K.H. Sun, Jun Gong, Chao Sun, Zhong Guang Wang, G.P. Zhang

Internal Friction of Copper Thin Layers on Silicon Substrates

Authors: J. von der Hagen, M. Weller, E. Arzt

Residual Stress Measurement in Sputtered Copper Thin Films by Synchrotron Radiation and Ordinary X-Rays

Authors: Mitsuhiko Hataya, Takao Hanabusa, Kazuya Kusaka, Kikuo Tominaga, Tatsuya Matsue, Osamu Sakata

Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization

Authors: J.P. Chu, C.H. Lin

Stress-Assisted Atomic Migration in Thin Copper Films

Authors: Takao Hanabusa, Kazuya Kusaka, Kenta Kaneko, Osamu Sakata, Masayuki Nishida

Tensile and Fatigue Properies of Ultrathin Copper Films and their Temperature Dependence

Authors: Qiao Neng Guo, Shi E Yang, Ming Xing Wang, Yu Ping Huo

Texture and Mechanical Properties of Electrodeposited Copper Thin Films

Authors: Adam Bunsch, S.J. Skrzypek, J. Kowalska, Wiktoria Ratuszek, W. Rakowski

Thickness of Polycrystalline Copper Coating Measured by X-Ray Diffraction

Authors: S.J. Skrzypek, M. Goły, J. Kowalska, K. Chruściel