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Articles by keyword: «Copper Films»

• Effects of Grain Size on Fatigue Crack Propagation in Copper Film
  Published in: Advances in Fracture and Damage Mechanics IX (p289)
• Fatigue Properties of Nanometer-Scale Copper Films
  Published in: Progresses in Fracture and Strength of Materials and Structures (p116)
• Internal Friction of Copper Thin Layers on Silicon Substrates
  Published in: Defects and Diffusion in Metals (p285)
• Residual Stress Measurement in Sputtered Copper Thin Films by Synchrotron Radiation and Ordinary X-Rays
  Published in: Residual Stresses VII, ICRS7 (p661)
• Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization
  Published in: THERMEC 2006 (p3497)
• Stress-Assisted Atomic Migration in Thin Copper Films
  Published in: Progresses in Fracture and Strength of Materials and Structures (p671)
• Tensile and Fatigue Properies of Ultrathin Copper Films and their Temperature Dependence
  Published in: Materials for Environmental Protection and Energy Application (p296)
• Texture and Mechanical Properties of Electrodeposited Copper Thin Films
  Published in: Applied Crystallography XXI (p141)
• Thickness of Polycrystalline Copper Coating Measured by X-Ray Diffraction
  Published in: Applied Crystallography XXI (p9)