| Paper Title | Page |
|---|---|
|
Effects of Grain Size on Fatigue Crack Propagation in Copper Film Authors: Kenichi Shimizu, Tashiyuki Torii |
289 |
|
Fatigue Properties of Nanometer-Scale Copper Films Authors: Bin Zhang, K.H. Sun, Jun Gong, Chao Sun, Zhong Guang Wang, G.P. Zhang |
116 |
|
Internal Friction of Copper Thin Layers on Silicon Substrates Authors: J. von der Hagen, M. Weller, E. Arzt |
285 |
|
Authors: Mitsuhiko Hataya, Takao Hanabusa, Kazuya Kusaka, Kikuo Tominaga, Tatsuya Matsue, Osamu Sakata |
661 |
|
Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization Authors: J.P. Chu, C.H. Lin |
3497 |
|
Stress-Assisted Atomic Migration in Thin Copper Films Authors: Takao Hanabusa, Kazuya Kusaka, Kenta Kaneko, Osamu Sakata, Masayuki Nishida |
671 |
|
Tensile and Fatigue Properies of Ultrathin Copper Films and their Temperature Dependence Authors: Qiao Neng Guo, Shi E Yang, Ming Xing Wang, Yu Ping Huo |
296 |
|
Texture and Mechanical Properties of Electrodeposited Copper Thin Films Authors: Adam Bunsch, S.J. Skrzypek, J. Kowalska, Wiktoria Ratuszek, W. Rakowski |
141 |
|
Thickness of Polycrystalline Copper Coating Measured by X-Ray Diffraction Authors: S.J. Skrzypek, M. Goły, J. Kowalska, K. Chruściel |
9 |