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Articles by keyword: «Copper Substrate»

• Experimental Study on the Ultraprecision Lapping Technology of the Copper Substrates for Alloy Films
  Published in: Advances in Grinding and Abrasive Technology XIV (p349)
• Microstructure and Wear Resistance of Laser Cladding of Ni-Based Alloy on Copper Substrate
  Published in: Optoelectronic Materials (p1061)
• Oxidation Behavior of Thermal Barrier Coatings on Copper Substrates
  Published in: 12th INTERNATIONAL CERAMICS CONGRESS PART E (p74)
• Preparation and Properties Study of Laser Cladding of Ni-Based Alloy on Copper
  Published in: Manufacturing Automation Technology Development (p216)
• Research on Cu-Fe Laser and Tungsten-Arc Inert-Gas Hybrid Welding
  Published in: Optoelectronic Materials (p961)
• Study on Non-Cyanide Silver Electroplating with Copper Substrate
  Published in: Advanced Manufacturing Technology (p2936)
• Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy Films
  Published in: Surface Finishing Technology and Surface Engineering (p141)
• Technological Research on Preparing the Ni—Cr Cladding Layer on the Surface of Copper
  Published in: Advances in Engineering Design and Optimization (p1384)