Papers by Keyword: Curing Process

Abstract: This work presents a hybrid formulation combining the Method of Fundamental Solutions (MFS) and the Method of Particular Solutions (MPS) coupled with an implicit Finite Difference Method (FDM) to simulate the transient heat conduction in a two-layer domain composed of a steel tool and an epoxy resin. The proposed approach incorporates a non-homogeneous source term in the governing equation, allowing the analysis of the curing heat release within the resin layer while maintaining a meshless boundary-based structure. Sequential numerical tests were performed to empirically assess the influence of key hyper-parameters number and position of source points, distance parameters, and the Tikhonov regularization factor on the stability and accuracy of the method. The MFS-MPS/FDM model showed excellent agreement with the finite element results reported by Dei Sommi et al., achieving low RMSE and MAE values relative to the thermal scale of the process. These results confirm the robustness and predictive capability of the MFS in capturing transient thermal evolution even in the presence of a source term, although its performance remains sensitive to the proper calibration of numerical hyper-parameters.

Abstract: Deep mining operations require special measures in order to keep safe and economic aspects. After mine ore is extracted, voids are created and need to be filled with high-strength, low-cost materials. Cemented Paste Backfill (CPB) has recently become one of the main alternatives in filling stopes. Although numerous papers have mentioned the magnitudes of the strength of this material, its behavior under high confining pressures is still not well understood. Therefore, the purpose of this study is to increase the knowledge regarding the CPB behavior. Triaxial compression tests were performed using a Hoek Cell and Load Frame System under high confining pressures. Samples with two different binder contents were used in order to obtain the CPB strength improvement. Besides the self-weight consolidation curing method, samples were subjected to a different curing method that simulated a zero gravity condition (rotating wheel) in the first curing day to compare their mixture properties. The results suggested that both curing method and binder content have influenced the geomechanical properties of Cemented Paste Backfill. By increasing the curing time, the CPB shear strength has increased slightly, whereas specimens with higher binder content presented a significant increase in shear strength values.

Abstract: The strain in curing process of composite part would be influenced by curing compaction, resin flow, curing action and tool-part interaction, meanwhile these factors would also influence the final cured quality of composite part. In this paper, FBG(fiber Bragg grating) sensors are used to in-situ monitoring the strain of composite parts, which are cured in four different pressure situation by autoclave: 0.0Mpa,0.2Mpa,0.4Mpa,0.6MPa. by analyzing the strain change rule, the part quality is predicted, then the predictive result is compared with some verification method: measurement of part’s boundary dimension, ultrasonic phased array scanning, metallographic analysis. The result shows that, the prediction is consistent with verification, the in-situ monitoring method by using FBG sensor is available for predicting cured quality of composite parts accurately: increase curing pressure is benefit of part compaction, resin flow, and reduce delamination,pores in composite part, finally improving the part quality dramatically.

Abstract: Epoxy adhesive used in electronic packaging could normally be cured by ultraviolet light, heat at high temperature or dual cured by both processes. Differential scanning calorimetry (DSC) has been used to identify and analyze the occurred reaction during the curing process. The structural modification of epoxy during curing could be examined by measuring its thermal properties, and the change in molecular structure of epoxy could be observed by a relative small area of DSC peak. This provided the heat amount required for complete cure. It is found that the DSC peak area after heat cure at 90 °C increased linearly as a function of heating time while that at 120 °C decreased exponentially. For UV cure, it indicated that the curing mechanism was strongly depend on the energy from UV light. For dual cure at 90 °C, the heat curing time could be reduced from single curing process of 50 minutes to 6 minutes, while the heating time for dual cure at 120 °C could be reduced from 4 minutes to 2 minutes.

Abstract: Epoxy adhesive has been widely used in microelectronic production process and the technique to determine the degree of tiny dot adhesive cure is essential to evaluate the products. In this work, micro Raman spectra were demonstrated to examine the adhesive curing at small diameter of about hundred micrometers. There are two Raman peaks that can be observed then modification during the curing process while it is bond to observe the change in the infrared absorption due to the background absorption. These two Raman peaks located at 1260 and 790 cm^-1 due to C-C breathing and C-O-C epoxide ring vibrating, respectively. It is found that the relative peak heights decrease as a function of UV exposure time. The vibration of Raman peak for heat cure were investigated for comparison the bond vibration of epoxy was also study by DFT in term of vibration rotation analysis for both close and open epoxy ring models which used to describe the vibration before and after curing processes. The open epoxide ring model shows the reducing of epoxide peak. Relative Raman peak heights are proposed to be used for determining the degree of adhesive cure. With imaging ability of micro Raman system, the mapping of curing sample can be illustrated by setting the color map with the proposed relative Raman peak height.

Abstract: Conductive ink has been widely used in many application of electronic parts. It normally comes in liquid form and will need to be cured usually by conventional oven or laser irradiation after it is drawn to expose its metallic contents. But, these curing processes suffer from numerous problems consist of laser is a costly process and a warping defect when cured using conventional oven. Thus, alternative process is prominent and DLP projector has been seen capable of polymerised photopolymer materials. By making use of its potential associated with a proper control of the light intensity, exposure time and distance, it could provides sufficent heat to cure conductive ink. This study investigates the curing process of silver conductive ink on polymer substrate using DLP projector light with a variation of curing time and distance. Electrical resistance, hardness and adhesion level of cured sample were measured to determine its functionality. The conductive ink is deposited on the substrate using a doctor blade method and Microsoft Powerpoint slide is used to shape the light image produced by the projector. It was found that the conductivity and curing level of the sample cured were higher at the distance which getting the sharpest light image. The performances of the samples were also greater as the curing time increased. DLP projector is able to cure the conductive track efficiently with shorter curing time apart from the cheap preparation and setup cost.

Abstract: Hydroxyl zinc mono-methacrylate/carbon black/hydrogenated nitrile rubber composites were prepared by using HZMMA as a partial substitution for carbon black. The morphology and properties of the composites during the vulcanization process were investigated. The results showed that during early stage of the curing process, the tensile strength and modulus at 100% of the composites increased slightly, the tear strength and elongation at break decreased. The favorable mechanical properties for composites could be achieved after post-curing. FTIR, XRD, and TEM results showed that the polymerization of HZMMA completes at the beginning stage of curing process. Grafting and crosslinking reaction between HZMMA and HNBR may occur during the curing process and metallic bridge bond between them forms. The phase state of homopolymer transformed from disperse phase to continuous phase and has a good compatibility with HNBR.

Abstract: Oratosquilla oratoria was the experimental raw materials in the paper. Design expert8.0.6 and Excel2007 was used to analyze the optimal process with the factors which were curing time, curing temperature, curing salt contention and the index which was the total bacteria. The pathogenic bacteria and sensory score under various curing conditions were determined simultaneously. After analyzing the significance of the various factors and interactions, the results showed the optimum curing conditions of oratosquilla oratoria were as follows: curing time 7.14h, curing temperature 14.34°C, curing salt contention 8.3%. Under this condition no pathogenic bacteria was detected and the sensory score was the highest.

Abstract: Autoclave curing is a common practice to manufacture high temperature thermoset matrix composites in order to improve the mechanical properties of the final product. The cycle design i.e. the definition and optimization of the temperature-time curve is a key issue for a competitive production. In this paper a very fast and effective procedure, based on the coupling of a finite element thermochemical model of the process and an artificial neural network, is proposed to predict the evolution of temperature in predefined control points inside the processing material. The model has been tested against the imposed thermal cycle used as an input. The procedure is tested simulating the curing process of a three-dimensional double-curved shape. Obtained outcomes highlighted the remarkable capabilities of the implemented procedure in terms of reliability of temperature predictions and of drastic reduction of the computational time with respect to classic computational models.

Abstract: Boron nitride (BN) was prepared by polymer-derived method using precursor poly [(alkylamino) borazin (PABZ). The evolution of composition and structure of precursor PABZ into BN ceramic during curing and pyrolysis process was investigated by FTIR, TG, XRD techniques and chemical analysis. The results showed that PABZ could fulfill curing heated at 80°C for 2hrs in NH₃ atmosphere. During the curing process the both transamination reaction and condensation reaction occurred, resulting in cross-link between monomer molecular. With the proceeding of curing process, the new B-N bonds were formed and continued to expand in three dimensions. After cured treatment the thermal pyrolysis of PABZ in ammonia atmosphere was took place, and inorganic degree and crystallinity of products were better, which was more suitable for preparation of high purity hexagonal BN (h-BN) ceramic.