Papers by Keyword: Defect

Abstract: Comparative studies of defect microstructure in 4H-SiC wafers have been carried out using photoluminescence (PL) imaging and grazing-incidence Synchrotron White Beam X-ray Topography. Images of low angle grain boundaries on the PL images correlate well with SWBXT observations, and similar correlation can be established for some micropipe images although the latter is complicated by the overall level of distortion and misorientation associated with the low angle grain boundaries and the fact that many of the micropipes are located in or close to the boundaries. This validation indicates that PL imaging may provide a rapid way of imaging such defect structures in large-scale SiC wafers.

Abstract: Thermal anisotropy in 4H-, and 6H-SiC bulk single crystal wafers was studied by the PPE method. The thermal diffusivities of the [1-100] and [11-20] orientations (^c-axis) samples were higher than those of the [0001] orientation (//c-axis) samples. Moreover, the thermal anisotropies of the lattice component and the carrier component were analyzed by Raman measurement.

Abstract: The effects of measurement technique and measurement conditions (injection level, temperature) on the measured carrier lifetimes in n- 4H-SiC epilayers are investigated. For three optical measurement techniques, it is shown that the high and low injection lifetimes can vary dramatically. Differences in the lifetime for varying injection level and temperature are approached both experimentally and via carrier dynamics simulations, assuming Z1/Z2 as the dominant defect. Reasonable agreement between measured and calculated behavior is obtained, as is insight into the recombination kinetics associated with the lifetime limiting defect.

Abstract: X-ray diffraction (XRD) rocking curves were mapped across 4H-SiC, 3-inch, 8° off-cut substrates prior to and after epitaxial growth, where a pattern of slightly higher defectivity region was clearly seen. This same pattern was apparent in both cross-polarization images of the epiwafers and microwave photoconductivity decay (μ-PCD) lifetime maps of the epilayers, where the latter shows the lifetime in the high defectivity regions had drastically decreased. Within the short lifetime regions, electron trap concentrations were similar to that as in the long lifetime regions as determined by deep level transient spectroscopy; however, the extended defect density was significantly higher. Consequently, high spatial resolution XRD can be a valuable tool in preselecting substrates for epitaxial growth to produce low defect density material with long injected carrier lifetimes.

Abstract: We identified regions with low Schottky barrier height on 4H-SiC surfaces by the electrochemical deposition of ZnO. When we adopt an appropriate deposition voltage, ZnO grew preferentially at the regions with the low Schottky barrier height. Thus, we were able to identify the ZnO film only at these regions if we stopped the deposition at a proper time. We compared positions of the deposited film and etch pit after molten NaOH etching. As a result, in a bulk 4H-SiC, the films were deposited around some of micropipe positions. On the other hand, in an epitaxial 4H-SiC layer, although approximately a half of deposited films seemed to grow at the etch-pit defect positions, other deposited films were grown at positions without etch-pit defects. Therefore the Schottky barrier heights were reduced by not only defects emerging as etch pits but also other kind of origins in epitaxial 4H-SiC.

Abstract: We investigated the expansion of single Shockley stacking faults (SSFs) in a 4H-SiC epitaxial layer under high-intensity scanning laser beam during room temperature photoluminescence mapping, which is similar to the degradation of bipolar pin diodes during forward current injection. In an epitaxial layer on an 8 off-axis (0001) substrate, the SSF-related intensity patterns induced by scanning high-intensity laser beam were classified into two types. The first one was a triangular pattern and the second a pattern which expanded in accordance with the motion of the scanning laser beam. The origins of the SSFs responsible for both patterns are presumably due to the preexisting basal plane dislocations and the dislocation-loops on the basal plane in the epitaxial layer, respectively. On the other hand, most of the SSF-expansion in on-axis (11 2 0) epitaxial layers were similar to the second type in the (0001) epitaxial layer. We, therefore, suggest that the dislocation-loops, which were located close to the surface, were dominant nucleation-sites of the SSFs in the (11 2 0) epitaxial layers.

Abstract: In EPR (electron paramagnetic resonance) identification of point defects, hyperfine (HF) interaction is decisive information not only for chemical identity but also for the local geometry and the electronic state. In some intrinsic defects in SiC, the wave function of the unpaired electron extends quite unevenly among major atoms comprising the defects. In such a case, the determination of the number of equivalent atoms and the chemical identity (Si or C) of those atoms even with weak HF splitting are useful to compare with HF parameters obtained theoretically. For vacancy-related defects of relatively deep levels, the sum of the spin densities on the nearest-neighbor shell is found to be 60-68%.

Abstract: The influence of in situ etching of Si-face n-4H-SiC wafers in H2 and propane on the surface morphology of the grown epi-layers were examined using differential interference contrast (DIC) optical microscopy and atomic force microscope (AFM). Two defect-selective etching techniques were applied in order to reveal the type and spatial distribution of defects in the substrates and epi-layers. It was found that for the flow applied in this experiment propane plays a significant role for the etching process. Depending on temperature and etching time we obtained completely different picture of substrate surface morphology. The propane etching was verified as a tool for substrate surface improvement.

Abstract: Basal Plane Dislocations (BPD) in SiC are thought to cause degradation of bipolar devices as they can trigger the formation and expansion of stacking faults during device operation. Therefore, epilayers without any BPD are strongly recommended for the achievement of long-term reliable bipolar devices. Such epilayers can be achieved by supporting the conversion of BPD into Threading Dislocations (TD), which depends on the epitaxial growth mode (as described in literature). In this work, the influence of several pre-treatments of the SiC substrate prior to epitaxial growth and different epitaxial growth parameters on the reduction of the BPDs in the SiC epilayers was investigated on 4° off-axis substrates. The dislocation content in substrates and epilayers was determined by Defect Selective Etching (DSE) in molten KOH. The averaged BPD density in epitaxial layers can be reduced to < 100 cm-2 for substrate preparation techniques and to < 30 cm-2 for well-suited epitaxial growth parameters. A certain combination of epitaxial growth parameters leads to < 3 BPD/cm2 in the epitaxial layer.

Abstract: A novel Monte Carlo kinetic model has been developed and implemented to predict growth rate regimes and defect formation for the homo-epitaxial growth of various SiC polytypes on different substrates. Using this model we have studied the generation of both point like and extended defects in terms of the growth rate and off-cut angle, finding qualitative agreement with both electrical and optical characterization and analytical results.