Papers by Keyword: Diamond Wire Saw

Abstract: In order to study the manufacturing process of diamond wire saw with magnetized baseline, we established a geometric model of the distribution of magnetic force lines around the magnetized baseline, assumed that the abrasive particles were suspended around the baseline, and analyzed the force of the baseline on the abrasive particles. Without considering the pretreatment of wire saw, the physical model of sand loading process was established. The influence of baseline magnetization on the preparation efficiency and performance of wire saw was analyzed by SEM, EDS, XRD, microscope and Gauss meter. The results show that: after baseline magnetization, it has magnetism and produces force with abrasive particles; baseline magnetization can attract abrasive particles, effectively shorten the sanding time and improve the preparation efficiency of wire saw; using the above process to prepare wire saw can ensure high durability and increase the preparation efficiency by three times.

Abstract: In order to study the basic rule of diamond wire saw slicing SiCp-Al composites, the theoretical analysis and experiments were carried out. The influences of diamond wire saw slicing speed and workpiece feed speed on surface quality and machining efficiency were discussed. The analysis results show that the machined surface gets smoother when diamond wire saw slicing speed changes from 2m/s to 3.5m/s, but gets rougher when diamond wire saw slicing speed changes from 3.5m/s to 4m/s. And the surface gets rougher when workpiece feed speed changes from 0.5m/s to 1m/s.The machining efficiency gets higher when diamond wire saw slicing speed and workpiece feed speed increase. These results provide guidance for selecting reasonable parameters in future research.

Abstract: As diamond wire saw machining device, the vibration characteristics of beaded rope has important implications on the processing quality and the service life. Based on it, this topic used the Galerk and complex modal method to research the changes of natural frequency of lateral vibration characteristics under different parameters, and comparative analyzed the effect of two methods on the natural vibration characteristics. Firstly, through an analysis on vibration mechanics model used complex modal method, the author obtained the exact solution of natural frequencies under different parameters, after that, utilized the Galerkin method to discrete the system vibration equations for getting the first N natural vibration characteristics. According to comparative analyzed the natural vibration characteristics of two algorithms, the results showed that, using appropriate Galerkin method will obtain more accurate solutions,as well as provide theoretical support on suppressing the vibration of beaded rope.

Abstract: Development of high efficient and high accuracy slice processing technology is required for realizing the high quality and low cost large SiC wafer. Our target of high speed slicing is slicing a 6 inch SiC single crystal ingot in about 9 hours. This slicing speed is about 10 times higher than the loose abrasive slurry sawing and about 4 times higher than the current technology of diamond wire sawing. The slicing speed and the slicing accuracy are in the relationship of trade-off. Therefore, in this research, we have studied the high speed slicing technique of 3 inch and 4 inch SiC single crystal ingot aiming at reduction of sliced wafers SORI. Moreover, we have extracted subjects to scale-up for the high speed slicing of the 6 inch SiC single crystal ingot.

Abstract: In order to study the physical nature and basic rule of diamond wire saw slicing SiCp-Al composites, the slicing mechanism was studied in theory first. There are different ways of slicing Al and SiC particles respectively: Al is sliced in plastic way and SiC particles are sliced in brittle ways such as being cut off or pulled out or pressed into matrix or burst. Then based on the finite element software Abaqus, the process of diamond wire saw slicing SiCp-Al composites was simulated. The distribution of internal stress and surface topography was discussed: The internal stress in SiC particles is far high than that in Al. The surface topography of sliced SiCp-Al composites is determined by SiC particles states mainly. The research results provide reference and guidance to the optimization of actual process of diamond wire saw slicing SiCp-Al composites.

Abstract: The structure design of the underwater diamond wire saw test bench system was conducted for the research of the diamond wire saw cutting mechanism. Through the kinematic analysis of the test-bed parallel lever mechanism, parallel loading mechanism equation was derived, which provided a basis for the cutting force distribution of the loading bow.Software ANSYS was used for the modal analysis of the test bench mechanism. As the theoretical analysis and calculation result showed, the test bench design in this paper realizedthe validation of the diamond abrasive cutting principle, which can serve as guidance for theprocessing and manufacturing of the test bench.

Abstract: Slicing of silicon, quartz crystal and other hard brittle materials mainly use dissociated abrasive multi-wire saw slicing technology, which exists some shortcomings, such as severe environmental pollution, lower cutting efficiency, etc. So it is bound to be replaced by fixed abrasive diamond wire saw in the future. At present, generally, the manufacturing technology of fixed diamond wire saw includes electroplating method and resin bonded method. Compared with electroplating diamond wire saw, the resin bonded diamond wire saw has obvious advantages, such as simpler production technique, lower cost, higher cutting efficiency, less environmental pollution, etc. In this paper, the polyurethane was chosen as matrix resin of resin bonded, and phenolic resin was chosen as curing agent, the preparation technology of thermosetting resin bonded diamond wire saw, is researched in this paper. Firstly, the effects of various compositions on resin bonded, are researched, then the optimal fomula and the manufacturing technology are determined

Abstract: Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in wafering. However, the higher cost and poor sliced wafer surface are still the obstacles for the diamond wire saw to totally replace slurry wire saw. In this study, the distribution of diamond grits on the wire was investigated by numerical simulation. The results show that there is a critical value of the abrasive interval to transfer the machining mechanism from plastic plowing to brittle indentation cracking for the material removal. The value depends on both the wire tension and bow angle during the operation.

Abstract: The slicing technology of hard-brittle materials by endless diamond wire saw has the advantages of higher moving speed of wire saw, better slicing quality, and thin kerf. According to the strength of wire saw, the cutting force and the random vibration of wire saw, the slicing parameters are optimized. As single crystal silicon is sliced, the constant feed force is less than 10N, the maximum pretension is 30N, and the highest moving speed of wire saw is 24m/s. But because the restrict of machine precision, the highest slicing speed is 16m/s.

Abstract: In this paper, the fall off and wear of electroplated endless diamond wire saws were studied when cutting granite. The self-made electroplating diamond wire saw was adapted in the experiment. Diamond particle size used was 200-230 US mesh. A kind of granite named Shi Daohong 375-2 with 18mm thickness was sawed. The test piece was sawed with constant cutting speed and feeding pressure. The topographies of wear, breakage and fall off of diamond grains were observed by using scanning electron microscopy. It was showed by the research that the damage of diamond grains appeared three forms including polishing wear and partial breakage and whole breakage. The fall off of diamond grain could be divided into two kinds of partial fall off and whole fall off during the cutting process. At the beginning cutting period, the wear of diamond grain mainly was polishing wear and partial breakage and with the extension of cutting time, the diamond grains would take place whole breakage and fall off.