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Articles by keyword: «Diffusion Barrier»

• A Novel Duplex Re-NiW Based Diffusion Barrier on a Nickel-Base Superalloy for TBC Systems
  Published in: High Temperature Corrosion and Protection of Materials 7 (p127)
• Ab Initio Simulations of Low-K and Ultra Low-K Dielectric Interconnects
  Published in: Nanoscience and Technology (p1061)
• Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization
  Published in: THERMEC'2003 (p3439)
• Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p281)
• Development of a NiW In Situ Diffusion Barrier on a Fourth Generation Nickel-Base Superalloy
  Published in: High Temperature Corrosion and Protection of Materials 7 (p23)
• Development of an Oxidation Resistant Coating on Nb-Based Ultra-High Temperature Alloy
  Published in: High-Temperature Oxidation and Corrosion 2005 (p309)
• Diffusion Barriers in Semiconductor Contact Technology
  Published in: Diffusion in Materials DIMAT 1996 (p1271)
• Diffusion of Alloying Elements into Al₂O₃ Coating Films on Ods Alloys
  Published in: Diffusion in Materials - DIMAT 1992 (p1089)
• Diffusion of Hydrogen in Metallic Multilayers
  Published in: Diffusion in Materials DIMAT 1996 (p945)
• Effect of Microstructure on Diffusion Barrier Capability of RF-Sputtered Titanium and Zirconium Nitride Films
  Published in: Diffusion in Materials - DIMAT 1992 (p667)
• Energetic Landscapes and Diffusion Properties in FeCu Alloys
  Published in: MULTISCALE KINETIC MODELLING OF MATERIALS (p31)
• Evaluation of Sputtered Tungsten as Diffusion Barrier Materials for Copper
  Published in: Diffusion in Materials DIMAT 1996 (p1285)
• Fabrication of Ta-Al-N Thin Films and its Cu Diffusion on Barrier Properties
  Published in: Advanced Materials and Processing (p593)
• Heat-Resistant Barrier Contacts Made on the Basis of TiB_x and ZrB_x to SiC and GaN
  Published in: Silicon Carbide and Related Materials 2008 (p565)
• High-Temperature Reliable Ni₂Si-Based Contacts on SiC Connected to Si-Doped Al Interconnect via Ta/TaN Barrier
  Published in: Silicon Carbide and Related Materials 2008 (p561)