Papers by Keyword: Ductile Mode Cutting

Abstract: The requirement of the ultra-precision machine tools for ductile cutting of hard brittle materials was examined experimentally. One of the essential factors of achieving ductile mode cutting was not only high-resolution feedback control but also the dynamic performance of the machine tool in forming solid immersion lens of monocrystalline silicon. We also proposed newly developed method for ultra-precision machine tools, which does not have enough high dynamic performance in order to achieve ductile mode cutting of the hard brittle materials. An additional device consisted of air slider on the machine tool was applied to cutting of glass in order to keep stable ductile mode cutting. We fabricated high-value added structure, which are designed a diffraction grating, consisted of micro groove on a borosilicate crown glass surface with the developed device.

Abstract: The mechanical properties of Potassium Dihydrogen Phosphate (KDP) crystal had been relatively well investigated, and it was reported that mechanical properties of KDP crystal are anisotropic corresponding to crystallography orientation. However, the affect of the crystallography orientation to the critical undeformed chip thickness and cutting force variation in ductile mode cutting of KDP crystal are still not clear, which are important in determining proper cutting parameters to get fine finished surface. This paper investigates the influence of crystallographic orientation to critical undeformed chip thickness by a kind of groove cutting on {001} plane, and the influence to cutting force is also researched by face turning. The experiment results demonstrate that the cutting forces and critical undeformed chip thickness for ductile mode cutting varies greatly according to KDP crystallographic orientation. This paper point out that two slipping plane, {110} and {1__,10}, account for the variation of cutting force and critical undeformed chip thickness in different orientation on {001} plane. A set of cutting parameters for ductile mode cutting are selected based on the derived critical undeformed chip thicknesses at different crystal orientations, and overall sooth surface has been achieved on face turned {001} surface, which the roughness is Ra 2.6nm measured by Veeco white-light interferometer.

Abstract: Microgroove processes are carried out on Potassium Dihydrogen Phosphate (KDP) crystals of different crystalline orientation using diamond tool, the speed of groove is very low in order to avoid the influence of temperature. The main process characteristics are examined including the groove geometry, cutting forces and critical underformed chip thickness at the onset of ductile-to-brittle cutting transition. Additionally, the cutting pressure is calculated from the cutting force and grooving geometry. The experimental results show that as the groove depth increase, the groove geometry clearly revealed that ductile-to-brittle cutting transition occurred, and the transition are well reflected by changing in the cutting pressure. Further, it is shown that the critical undeformed chip thickness varies greatly with the workpiece KDP crystalline orientation.

Abstract: Potassium Dihydrogen Phosphate (KDP) crystals are used for the key components in high power density solid-state laser for Inertial Confinement Fusion. KDP crystals are mainly machined in the dry cutting condition to avoid ‘Fogging’ of the crystals. The main difficulty identified in dry machining of KDP is chip removal from the machined surface. A vacuum sucking device based on venturi vacuum pump is used to suck the chips during cutting, and the relationship between level of vacuum in cutting zone and the comply air pressure was established. An empirical model for chip emission during turning processes is used to analyze the influence of cutting parameters on the chip emission. The influence of cutting parameters on the removal of chips is investigated. Finally, a face turning of KDP crystals is carried out with the turning parameters of feed rate 1um/rev, depth of cut of 0.8 um/rev and the cutting speed from 1.82m/s to 3.9m/s. A super-smooth surface with chips free in the whole sample is achieved, having the surface roughness of 2.994nm (Ra) measured by AFM. The surface quality achieved satisfies the requirements of KDP crystals implemented in high power lasers.

Abstract: The confine of ductile-mode cutting and brittle-mode cutting seems to be a crucial step for designing a brittle material removal process. However, the existing transition from ductile-mode to brittle-mode for BK7 material makes the confine of different mode very difficult. Through a series of micro/nano-machining tests, measurements of cutting forces and morphological appearance of cutting groove as well as the cross section at the certain depth of cut, the confirmation of ductile-mode cutting, transition-mode cutting and brittle-mode cutting has been clearly described in the paper. This lays a foundation for the fundamental understanding of cutting physics concerning of material characteristics and cutting tools, and thereafter for the development of optimal process technology.