Papers by Keyword: Ductile Regime Grinding

Abstract: Glass panels are one of core components in liquid crystal displays (LCDs). Grinding is an essential edge chamfering process in the preparation of LCD glass panel. With the size of glass panel increasing, both high productivity and high quality are required in the edge chamfering process. However, surface and subsurface defects are usually introduced to the chamfered glass edge under high-efficiency grinding conditions. In this work, we explored to develop crack-free grinding process while maintaining high chamfering efficiency with two designed diamond wheels for the chamfering of LCD glass edges. The grinding performance was compared and analyzed in terms of surface roughness and morphology. Normal and tangential grinding forces were measured to characterize the material removal characteristics. It was found that crack-free grinding/chamfering of LCD glass edge was achieved under high-efficiency grinding conditions i.e. wheel speed of 52.3 m/s, feed rate of 10 m/min, depth of cut of 50 μm. The developed grinding process is potential to reduce subsequent polishing time and cost or even replace subsequent polishing process for the preparation of LCD glass edge.

Abstract: Surface plastic deformation form and residual stress distribution of nano-ceramics machined by ordinary grinding and two-dimensional ultrasonic grinding respectively were investigated. The obtained results show that machined surface residual stress in the two grinding modes is extrusion stress, and it decreased with the increasing of grinding depth. But the decrease of residual stress under two-dimensional ultrasonic grinding is less than that under normal grinding. In addition, under the same grinding parameters, the surface residual stress on two-dimensional ultrasonic vibration grinding is larger than that on ordinary grinding, and if other parameters unchanged, it is increased with the increase of wear particle granularity in the two grinding modes. It is produced by the reason that ductile regime of ceramic grinding become larger under ultrasonic grinding, so that material is still removed by plastic form at great depth. Plastic removal mode will produce greater surface extrusion stress, so with the increasing of grinding depth, the decreasing of residual stress under two-dimensional ultrasonic vibration grinding is less than that under the normal grinding. At the same time, the regular separating between wear particle and work piece improves the heat emission condition, which is also one of the reasons that the surface residual stress under two-dimensional ultrasonic grinding is larger than that under ordinary grinding.