Papers by Keyword: Electro-Thermal

Abstract: Electro-thermal analysis of a new micro-hotplate designed for gas sensor has been studied in this paper. Through the comparison of materials, select pt as electrodes material, Si, SiO₂ as substrate materials. Then, through the optimization of substrate structure, in order to make the gas sensor obtain perfect properties of good temperature uniformity, the thickness of Si substrate, thermal insulation layers are 150, 50, 100 µm respectively. The new micro-hotplate structure is benefit for the improvement of sensitivity and overall performance of the sensor.

Abstract: With development of MEMS pyrotechnics devices such as semiconductor bridge/metal bridges, the energy required to fuze ignition becomes smaller and smaller. The energy needed for traditional short-circuit is far greater than MEMS pyrotechnics devices explosive, and takes a large space of fuze, which does not accord with the smaller trend in fuse volume and ignition energy. This paper describes a MEMS short-circuit fuse based on electro-thermal theory, it has similar volume with MEMS pyrotechnics devices, and the energy required is less than the traditional shorts fuse. This short-circuit fuse has well safety features, short action time, small volume, low cost, and it is suitable to be used in fuse or other areas .

Abstract: Power electronic modules including insulated gate bipolar transistor (IGBT) are widely used in the field of power converter application. The temperature distribution inside these modules becomes more important for electrical characteristics, reliability and lifetime of integrated power electronic modules. In this paper, a seven-layer compact RC thermal component network model based on the physical structure is presented. A dynamic electro-thermal model, which is composed of electrical model, compact RC thermal component network model and electro-thermal interface is developed for the IGBT. These models interact with each other to calculate the temperature of each layer of module and parameters of each model. The thermal model determines the evolution of the temperature distribution within the thermal network and thus determines the instantaneous junction temperature used by the electrical model. Such built dynamic electro-thermal simulation methodology is implemented in the Saber circuit simulator, and the simulation result is validated by the experimental study, which adopted with infrared thermal imaging camera. The built dynamic electro-thermal model could be helpful for the research on operation performance and heat sink design for such power electronic devices.