Papers by Keyword: Electrodepositing

Abstract: Improvement of sensitivity of electrochemical sandwich enzyme immunoassay has been achieved by electrodepositing redox polymer on screen-printed carbon electrode surface, on which sandwich complex were formed.

Abstract: Influence of the electrodepositing parameters e.g. applied electric current as variable on texture formation and on mechanical properties of copper thin films was studied. Experiment was done for copper deposition from sulphate bath under galvanostatic and pulse current. It was found that copper layers exhibits different texture depending on applied current conditions during electrodepositing process. Pulse and direct current conditions leads to different texture of electrodeposited copper. Texture of electrodeposited copper coatings and mechanical properties could be correlated. It was found that, texture indexes although are not complex information about texture could be used for analysis of such correlation in technological process.

Abstract: Electrodeposition and other methods are employed to obtain metallic films and coatings. Copper coatings are most extensively used in circuit board industry and often as a base to further formation of other metallic films. Electrodeposited copper films (thin layers) are widely used in electronic and automotive industry so its electrical and mechanical properties and its thickness are important. Several methods are used for thickness determination of thin films and coatings for example mechanical, magnetic and ball crater with light microscopy methods. They are destructive and not precise enough. The X-ray fluorescence, absorption and diffraction are more frequently used due to better precision. Although they are complex and expensive, they pronounce an important feature like non-destructive character. For particular cases geometrical conditions and mathematical calculation procedure must be elaborated. An application of X-ray diffraction in grazing incidence angle for thickness determination is described in this article. The method is based on absorption principles of X-ray beam. The absorption is proportional to thickness of the coating and to incidence and to the diffraction angle which. Geometrical conditions were obtained experimentally and suitable mathematical calculations were introduced. The elaborated methodical approach was applied to thickness determination of copper coatings electrodeposited on a brass substrate.