Papers by Keyword: Electrolytic Capacitors

Abstract: The leakage currents of high nominal voltage conductive polymer tantalum (Ta) electrolytic capacitors are the difficulties in the research and development processing. The optimized and improved forming technical of increasing current density with the voltage rising was used in the present paper, and silane coupling agent has been used to the dielectric surface of the electrode body before polymerization, and conductive slurry was used to forming the cathode electrolyte of capacitors. Low leakage currents and high breakdown voltage have been tested; otherwise, the endurance capabilities of reverse voltage have prodigious enhanced.

Abstract: A cost-effective method for quickly evaluating the equivalent series resistance (ESR) of electrolytic capacitors is proposed. This approach has the ability to measure the low ESR of milliohms level, meanwhile provide the pulsed testing current up to hundreds of amperes. Therefore, this method is suitable for fast inspecting the quality of bulk capacitors. The operational principle, circuit implementation and the calibration method are presented, and the performances of the prototype are tested, which validate the proposed scheme.

Abstract: For the past 10 years Cerel has been engaged in the development of prototype, EPDprocessed, micro-components, primarily for the microelectronics industry. In this contribution we summarize some of the problems of integrating EPD into the production process, and discuss the parameters that need to be considered and controlled. Suitable dispersion media and additives can usually be found for powder of any chemical composition to be deposited by EPD, providing the particle size and size distribution, and their surface to volume ratio are suitable. So it is the geometrical requirements and the dimensional tolerances of the product that often limit the EPD process. We give three examples: the EPD embedding of passive components in a punched ceramic tape, the production of porous capacitor anodes by EPD, and the EPD formation and printing of narrow conducting lines on a ceramic tape substrate. In each case the production process parameters have been chosen to satisfy the engineering requirements while minimizing the the formation of process defects. Defects include: variations in particle packing density; loss of adhesion and deposit cracking, and surface roughness or thickness variations.