Papers by Keyword: Electron Beam Injection

Abstract: Electron beam injection(EBI) is a process of gathering the electrons in materials using electron beam(EB). The EBI technology is proposed for purification of silicon particles by removing metal impurities through high-temperature oxidation, EBI, and HF acid washing processes. Analysis of silicon particle morphology after high-temperature oxidation using digital camera and after EBI using scanning electron microscope(SEM) were conducted. Then, the composition of silicon particles was analyzed using inductively coupled plasma(ICP). The silicon particle colours turned bright after EBI; therefore, EBI can change the thickness of SiO2 films in addition to increasing the temperature of the silicon particles. The results show that this technology is effective in removing metal impurities in silicon particles.

Abstract: The electron beam injection (EBI) process involves offering electrons around silicon powder, whose surface was oxidized, and subsequently the powder is washed by HF acid so as to remove the SiO2 film. The new electron beam injection process, in which micro electric filed formed between Si and SiO2 film will accelerate impurities diffusion from Si to SiO2 film, was developed and applied to eliminate the transition-metal impurities of MG-Si. It is proved to be effective to remove transition-metal impurities from metallurgical grade silicon (MG-Si). By applying the electron beam injection method, the removal rate of 10% to 59% was achieved during the refining process. The efficiency of impurity removal originates from two aspects: the impurity concentration gradient on both sides of Si/SiO2 interface; the micro electric field formed from Si to SiO2 film. A further increase in the removal rate can be realized by controlling the processing parameters.